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Patent Searching and Data


Title:
CONNECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/199953
Kind Code:
A1
Abstract:
The present invention enables efficient transmission of a large current to a connection device, such as a switch or a connector, and to a contact thereof. A liquid metal switch of an embodiment comprises a liquid metal-impregnated sintered metal 12 in which a meshed sintered metal welded to a base electrode 11 is impregnated with a liquid metal, and a microneedle electrode 14 in which microneedles 14a with surfaces in a wet state due to a liquid metal coating 13 are arrayed on a plane facing the base electrode 11. In the liquid metal switch, a contact turns On/Off as the microneedles 14a of the microneedle electrode 14 with the liquid metal coating 13 thereon are inserted or removed with respect to the liquid metal-impregnated sintered metal 12 of the base electrode 11.

Inventors:
HARAKAWA KENICHI (JP)
Application Number:
PCT/JP2023/014924
Publication Date:
October 19, 2023
Filing Date:
April 12, 2023
Export Citation:
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Assignee:
EXH CORP (JP)
International Classes:
H01H29/16; H01H1/04; H01H1/06; H01R13/03
Foreign References:
JPH01168929U1989-11-29
JP2010218977A2010-09-30
JP2010282886A2010-12-16
JPS523117B11977-01-26
JPH05190219A1993-07-30
JP2020167164A2020-10-08
US20220044883A12022-02-10
KR20160118820A2016-10-12
Attorney, Agent or Firm:
IWAIKE Mitsuru et al. (JP)
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