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Title:
CONNECTION ASSEMBLY FOR MULTIPLE MODULE-TO-BOARD (M2B) OR MODULE TO MODULE (M2M) CONNECTION INCLUDING A PLURALITY OF UNITARY COAXIAL CONNECTION ASSEMBLIES WHEREIN THE OUTER CONTACT OF ONE SOCKET BEING INTEGRAL PART OF MODULE OF M2B OR M2M
Document Type and Number:
WIPO Patent Application WO/2024/050728
Kind Code:
A1
Abstract:
A connection assembly for a multiple module-to-module (M2M) or a module-to-board (M2B) connection includes a plurality of unitary RF connection assemblies (1), and each unitary RF connection assembly (1) comprises at least one socket (6), wherein at least an outer contact (61) of the socket (6) of the unitary RF connection assembly (1) is an integral part of one component of one module of the module-to-module (M2M) or the module-to-board (M2B) connection.

Inventors:
QIN SHAN (CN)
Application Number:
PCT/CN2022/117627
Publication Date:
March 14, 2024
Filing Date:
September 07, 2022
Export Citation:
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Assignee:
SHANGHAI RADIALL ELECTRONICS CO LTD (CN)
RADIALL SA (FR)
International Classes:
H01R12/71; H01R9/05; H01R13/514; H01R13/639
Foreign References:
CN114946087A2022-08-26
CN207303527U2018-05-01
CN103378429A2013-10-30
CN107196144A2017-09-22
US20020021541A12002-02-21
US20170317456A12017-11-02
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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