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Title:
CONDUCTIVE SUBSTRATE AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2024/043032
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a conductive substrate which has excellent sulfurization resistance in a conductive thin wire part and has suppressed color change over time. The conductive substrate according to the present invention has a base material and a conductive layer disposed on the base material, wherein the conductive layer has a conductive thin wire part containing a metal, and a shielding layer is provided on the conductive layer and includes a compound represented by a predetermined formula.

Inventors:
NAKAGAWA YUKI (JP)
TANAKA SATOSHI (JP)
NAKAYAMA AYA (JP)
Application Number:
PCT/JP2023/028431
Publication Date:
February 29, 2024
Filing Date:
August 03, 2023
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H05K3/28; G06F3/041; H01B5/14
Domestic Patent References:
WO2013128963A12013-09-06
Foreign References:
JP2009188360A2009-08-20
JP2015022397A2015-02-02
JP2008109022A2008-05-08
JP2023035785A2023-03-13
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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