Title:
CONDUCTIVE SHEET, WIRING BOARD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/204253
Kind Code:
A1
Abstract:
The present disclosure provides: a conductive sheet having a conductive composition which has outstanding metal recycling properties and good adhesive power and conductivity, prevents sticking to protective sheets during storage, and has outstanding protective sheet peeling properties, water droplet evaporation properties, and reworking properties; and a wiring board provided with said conductive composition. The conductive sheet of the present disclosure is a conductive sheet in which a conductive composition containing a metal powder (A) and a binder (B) is disposed on only one surface of a protective sheet (D), wherein the conductive composition dissolves, so as to leave a residue, when submerged for 24 hours in a specific type of solvent composition (C) at 30°C, the residue includes a metal element, and the peak density Spd of the surface of the conductive composition not facing the protective sheet (D) is 1,000-500,000/mm2.
Inventors:
NISHINOHARA SATOSHI (JP)
KOBAYASHI HIDENOBU (JP)
TODA MUNEO (JP)
KISHI DAISUKE (JP)
KOBAYASHI HIDENOBU (JP)
TODA MUNEO (JP)
KISHI DAISUKE (JP)
Application Number:
PCT/JP2023/015645
Publication Date:
October 26, 2023
Filing Date:
April 19, 2023
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
TOYOCHEM CO LTD (JP)
TOYOCHEM CO LTD (JP)
International Classes:
C09J9/02; C09J7/30; C09J11/04; C09J201/02; H01B1/22
Domestic Patent References:
| WO2020122114A1 | 2020-06-18 |
Foreign References:
| JP2015185717A | 2015-10-22 | |||
| JPH08217955A | 1996-08-27 | |||
| CN109943252A | 2019-06-28 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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