Title:
CONDUCTIVE PASTE, ELECTRONIC COMPONENT AND MULTILAYER CERAMIC CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2024/014427
Kind Code:
A1
Abstract:
The present invention provides: a conductive paste which uses a conductive powder and a ceramic powder that are refined for the size reduction and thickness reduction of a multilayer ceramic electronic component, and which is capable of forming an internal electrode layer that exhibits excellent adhesion, while having a smooth dry film; an electronic component; and a multilayer ceramic capacitor. The present invention provides a conductive paste which contains a conductive powder, a ceramic powder, a dispersant, a binder resin and an organic solvent, wherein: the binder resin contains a cellulose, a polyvinyl acetal, and a polymer compound which is obtained by bonding a cellulose compound and a polyvinyl acetal compound by means of sulfur atoms; and the molar ratio of the sulfur atoms contained in the polymer compound to the sum of the cellulose and the cellulose compound is 0.3 to 1.7.
Inventors:
SUZUKI NOBUHISA (JP)
OKUDA YUJI (JP)
OKUDA YUJI (JP)
Application Number:
PCT/JP2023/025430
Publication Date:
January 18, 2024
Filing Date:
July 10, 2023
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
H01B1/22; C08K3/00; C08K3/08; C08K3/24; C08L1/02; C08L1/10; C08L29/00; H01G4/30
Domestic Patent References:
| WO2015107811A1 | 2015-07-23 |
Foreign References:
| JP2004186339A | 2004-07-02 | |||
| JP2020029479A | 2020-02-27 | |||
| JP2018184569A | 2018-11-22 |
Attorney, Agent or Firm:
TAKINO, Fumio et al. (JP)
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