CONDUCTIVE PASTE, ELECTRODE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

Title:

CONDUCTIVE PASTE, ELECTRODE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2024/042764

Kind Code:

A1

Abstract:

This conductive paste contains (A) conductive particles and (B) a binder resin. The (A) conductive particles include surface-treated metal particles. The surface-treated metal particles each contain a metal particle and a surface-treated layer disposed on at least a portion of the surface of the metal particle. The conductive paste has high sulfidization resistance, and an electrode can be formed therefrom at relatively low cost.

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Inventors:

YOSHII YOSHIAKI (JP)
MORI KOHEI (JP)

Application Number:

PCT/JP2023/013483

Publication Date:

February 29, 2024

Filing Date:

March 31, 2023

Export Citation:

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Assignee:

NAMICS CORP (JP)

International Classes:

H01B1/22; H01B5/00

Foreign References:

JP2020158864A	2020-10-01
JP2018066048A	2018-04-26

Attorney, Agent or Firm:

TSUKUNI & ASSOCIATES et al. (JP)

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