CONDUCTIVE FILM, TOUCH PANEL, PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR PRODUCING CONDUCTIVE FILM

Title:

CONDUCTIVE FILM, TOUCH PANEL, PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR PRODUCING CONDUCTIVE FILM

Document Type and Number:

WIPO Patent Application WO/2021/200060

Kind Code:

A1

Abstract:

Provided are: a conductive film with which disconnection of metal wiring can be suppressed, and a wiring portion thereof is foldable and bendable; a touch panel; a photosensitive resin composition; and a method for producing the conductive film. The conductive film comprises, as a protective layer for an extraction wiring portion of the conductive film functioning as a touch sensor, a cured film which is formed from a photosensitive resin composition including at least one monomer represented by formulae (1) and (2), clay minerals, and a photopolymerization initiator.

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Inventors:

SAWAKI DAIGO (JP)
HASEGAWA KAZUHIRO (JP)

Application Number:

PCT/JP2021/010279

Publication Date:

October 07, 2021

Filing Date:

March 15, 2021

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

C08F290/06; C08F220/28; C08F292/00; G06F3/041; G06F3/044; H01B5/14; H01B13/00

Foreign References:

JP2011171544A	2011-09-01
JP2019175226A	2019-10-10

Attorney, Agent or Firm:

NAKASHIMA Junko et al. (JP)

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