Title:
CONDUCTIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/014625
Kind Code:
A1
Abstract:
A conductive adhesive composition which contains a conductive powder and a curable component, and which is able to achieve good bonding strength. This conductive adhesive composition contains (A) a conductive powder and (B) a curable component; the content of the curable component (B) is 20 parts by mass or more, if the content of the conductive powder (A) is taken as 100 parts by mass; and this conductive adhesive composition additionally contains (C) a phosphoric acid-containing curable component that is represented by general formula (1) or (2), while having a molecular weight within the range of from 150 to 1,000. In formula (1) and (2), X represents a hydrogen atom (H) or a methyl group (CH3). The content of the phosphoric acid-containing curable component (C) is from 0.01 part by mass to 5 parts by mass, if the total content of the conductive powder (A) and the curable component (B) is taken as 100 parts by mass.
Inventors:
ARAI TAKAMITSU (JP)
KASUGAI TAKAYUKI (JP)
OCHIAI NOBUO (JP)
TOMEKAWA SATORU (JP)
KASUGAI TAKAYUKI (JP)
OCHIAI NOBUO (JP)
TOMEKAWA SATORU (JP)
Application Number:
PCT/JP2021/026381
Publication Date:
January 20, 2022
Filing Date:
July 14, 2021
Export Citation:
Assignee:
KYOTO ELEX CO LTD (JP)
International Classes:
C09J4/02; C09J11/04; C09J133/00; C09J201/00; H01B1/22; H01L31/0224; H01M14/00
Domestic Patent References:
| WO2016171253A1 | 2016-10-27 | |||
| WO2016140204A1 | 2016-09-09 | |||
| WO2018043505A1 | 2018-03-08 |
Foreign References:
| JP2014170794A | 2014-09-18 | |||
| JP2017145382A | 2017-08-24 | |||
| JP2001257220A | 2001-09-21 | |||
| JP5746797B1 | 2015-07-08 | |||
| JP2018133331A | 2018-08-23 | |||
| JP2020164744A | 2020-10-08 | |||
| JP2013541611A | 2013-11-14 |
Attorney, Agent or Firm:
SHOSU Takeshi (JP)
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