COMPOSITION, METHOD FOR PRODUCING COMPOSITION, AND METHOD FOR PRODUCING SILVER FILM

Title:

COMPOSITION, METHOD FOR PRODUCING COMPOSITION, AND METHOD FOR PRODUCING SILVER FILM

Document Type and Number:

WIPO Patent Application WO/2023/243394

Kind Code:

A1

Abstract:

Provided is a composition containing: (A) a compound represented by general formula (1); (B) a compound represented by general formula (2); and (C) a silver compound. (In the formula, R1 and R2 each independently represent a hydrogen atom or a C1–C5 alkyl group.) (In the formula: R3 and R4 each independently represent a hydrogen atom, a sodium atom, a potassium atom or a C1–C5 alkyl group; and n represents 1 or 2.)

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WO/2004/036964	METHOD FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS WITH INTEGRAL PLATED RESISTORS
WO/2016/038914	SILVER-COATED COPPER POWDER, AND CONDUCTIVE PASTE, CONDUCTIVE COATING MATERIAL AND CONDUCTIVE SHEET, EACH OF WHICH USES SAID SILVER-COATED COPPER POWDER

Inventors:

TAKAHASHI TAKUYA (JP)
ISHIWATA SHINYA (JP)

Application Number:

PCT/JP2023/020058

Publication Date:

December 21, 2023

Filing Date:

May 30, 2023

Export Citation:

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Assignee:

ADEKA CORP (JP)

International Classes:

C23C18/42; C25D3/46; C25D7/00; C25D7/08

Foreign References:

JP2002356783A	2002-12-13
JP2014055314A	2014-03-27
JP2000160351A	2000-06-13
JP2007327127A	2007-12-20
JP2006206946A	2006-08-10

Attorney, Agent or Firm:

SOGA, Michiharu et al. (JP)

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