Title:
COMPOSITE MOLDED COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/145427
Kind Code:
A1
Abstract:
This composite molded component comprises an internal component having an electronic component body (element body part) and a lead wire that extends from the element body part, a primary molded part covering the internal component, and a secondary molded part covering the primary molded part. In the composite molded component, at least a portion of the lead wire is a soldered part soldered to another component (conducting wire end part). The primary molded part has a recess part that forms a gap with the lead wire in at least a part of a portion facing the soldered part.
Inventors:
TERASAKA YUKITOSHI (JP)
KOBAYASHI TOSHINARI (JP)
YAMAO MEGUMI (JP)
KOYANO HIROYUKI (JP)
KOBAYASHI TOSHINARI (JP)
YAMAO MEGUMI (JP)
KOYANO HIROYUKI (JP)
Application Number:
PCT/JP2023/000412
Publication Date:
August 03, 2023
Filing Date:
January 11, 2023
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
B29C45/14; B29C33/42; G01P1/02
Domestic Patent References:
| WO2003098226A1 | 2003-11-27 |
Foreign References:
| JP2018054298A | 2018-04-05 | |||
| JP2021085740A | 2021-06-03 | |||
| JP2015227026A | 2015-12-17 | |||
| JP2011529420A | 2011-12-08 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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