Title:
COMPONENT MOUNTING BOARD, METHOD FOR MANUFACTURING COMPONENT MOUNTING BOARD, ELECTRONIC MODULE, AND METHOD FOR MANUFACTURING ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2024/095813
Kind Code:
A1
Abstract:
The present invention obtains an electronic module which can prevent the occurrence of creep discharge and improve productivity. This electronic module (30) comprises: a circuit board (12) in which a metal layer (16) constituting a wiring pattern (18) and a metal base (13) are layered with an insulating layer (14) therebetween; an electronic component (20) bonded to the wiring pattern (18); and a coating film (24) formed, on the front surfaces and the side surfaces of the electronic component (20) and the circuit board (12) through ceramic coating or glass coating.
Inventors:
SUZUKI KOHEI (JP)
YUKIMASA TARO (JP)
SHIMOMURA KOHEI (JP)
YUKIMASA TARO (JP)
SHIMOMURA KOHEI (JP)
Application Number:
PCT/JP2023/038223
Publication Date:
May 10, 2024
Filing Date:
October 23, 2023
Export Citation:
Assignee:
NHK SPRING CO LTD (JP)
International Classes:
H01L23/29; H01L23/12; H01L23/31
Foreign References:
| JP2012084835A | 2012-04-26 | |||
| JP2007200982A | 2007-08-09 | |||
| JP2002522904A | 2002-07-23 | |||
| JPH11297869A | 1999-10-29 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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