Title:
COATING AGENT AND ELECTRONIC COMPONENT MODULE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/070548
Kind Code:
A1
Abstract:
Provided is a coating agent capable of forming a coating having high heat insulating properties. A coating agent according to the present invention is used to form a coating in an electronic component module in which an electronic component is mounted on a circuit board via a conductive adhesive portion and in which the conductive adhesive portion is covered by the coating, and comprises: a thermoplastic resin; a solvent for dissolving the thermoplastic resin; and hollow particles. The contained amount of the thermoplastic resin is 1.0-22.0 wt% with respect to a total of 100 wt% of the thermoplastic resin and the solvent. The contained amount of the hollow particles is 15.0-50.0 parts by weight with respect to a total of 100 parts by weight of the thermoplastic resin and the solvent.
Inventors:
KAMIYAMA AKIRA (JP)
ISHII YOUJI (JP)
ISHII YOUJI (JP)
Application Number:
PCT/JP2023/032555
Publication Date:
April 04, 2024
Filing Date:
September 06, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09D201/00; C09D7/20; C09D7/65; C09D133/00; C09D133/18; H05K3/28
Domestic Patent References:
| WO2022191063A1 | 2022-09-15 | |||
| WO2022130574A1 | 2022-06-23 | |||
| WO2020116539A1 | 2020-06-11 | |||
| WO2020184545A1 | 2020-09-17 |
Foreign References:
| JP2016068648A | 2016-05-09 | |||
| US20140345923A1 | 2014-11-27 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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