Title:
CLEANING LIQUID AND METHOD FOR CLEANING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/095923
Kind Code:
A1
Abstract:
This cleaning liquid for cleaning a substrate that has metal exposed on a surface thereof comprises a basic compound, an amino acid, and water, the cleaning liquid having the isoelectric point (pI) of the amino acid and the pH of the cleaning liquid at 23° that satisfy the condition of formula (1). The cleaning liquid does not contain a nitrogen heterocyclic compound, and the concentration of the basic compound relative to the total mass of the cleaning liquid is less than 12 mass%. (1): pI-2 < pH < pI+2
Inventors:
GO CHOITSU (JP)
WADA YUKIHISA (JP)
WADA YUKIHISA (JP)
Application Number:
PCT/JP2023/038941
Publication Date:
May 10, 2024
Filing Date:
October 27, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
H01L21/304; C11D1/00; C11D3/28; C11D3/43; C11D7/32
Domestic Patent References:
| WO2021131452A1 | 2021-07-01 | |||
| WO2021049208A1 | 2021-03-18 |
Foreign References:
| JP2014036136A | 2014-02-24 | |||
| JP2009278018A | 2009-11-26 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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