Title:
CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2023/100517
Kind Code:
A1
Abstract:
A circuit module (10) according to the present invention comprises: a substrate (20); a molded resin (30) that is located on a surface of the substrate (20), and has a first main surface (31) in contact with the surface of the substrate (20) and a second main surface (32) on the opposite side from the first main surface (31); and a stud electrode (40) that is located on the surface of the substrate (20), and the periphery of which is covered by the molded resin (30). The molded resin (30) has a recess (32a) that is formed such that part of the second main surface (32) is recessed. In the recess (32a), the stud electrode (40) has an exposed end surface (41) and an exposed side surface (42) that are exposed from the molded resin (30). A plating layer (60) is formed on the exposed side surface (41).
Inventors:
YABUKI HIROMASA (JP)
Application Number:
PCT/JP2022/039103
Publication Date:
June 08, 2023
Filing Date:
October 20, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/28; H01L23/28; H05K3/34
Domestic Patent References:
| WO2019059017A1 | 2019-03-28 |
Foreign References:
| JP2015508240A | 2015-03-16 | |||
| JP2004363250A | 2004-12-24 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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