Title:
CIRCUIT BOARD, LIGHT-EMITTING BASE PLATE, BACKLIGHT MODULE AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/092439
Kind Code:
A1
Abstract:
A circuit board comprises a substrate, a first electrically conductive layer, a first insulation layer and a second electrically conductive layer. The first electrically conductive layer is arranged on one side of the substrate. The first electrically conductive layer comprises a plurality of signal lines and a plurality of first electrically conductive portions. The first insulation layer is provided with a first via hole penetrating the first insulation layer. The second electrically conductive layer comprises a plurality of second electrically conductive portions; the second electrically conductive portions are in electric contact with the first electrically conductive portions by means of the first via hole; and each second electrically conductive portion comprises a bonding pad, which is the part of the second electrically conductive portion that is exposed from the first via hole in the first insulation layer. The first electrically conductive layer and the second electrically conductive layer each comprise at least one main electrically conductive layer; the main electrically conductive layer and solder can form a first intermetallic compound; at least one of the first electrically conductive layer and the second electrically conductive layer further comprises a stop layer; the stop layer is arranged between two adjacent main electrically conductive layers, and the stop layer and the solder can form a second intermetallic compound; and the rate of reaction between the stop layer and the solder is less than the rate of reaction between the main electrically conductive layer and the solder.
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Inventors:
YAO NIANQI (CN)
ZHAO KUN (CN)
NING CE (CN)
LI ZHENGLIANG (CN)
CAO ZHANFENG (CN)
WANG KE (CN)
ZHANG JIAXIANG (CN)
QI QI (CN)
HU HEHE (CN)
LI FEIFEI (CN)
HUANG JIE (CN)
HE JIAYU (CN)
ZHAO KUN (CN)
NING CE (CN)
LI ZHENGLIANG (CN)
CAO ZHANFENG (CN)
WANG KE (CN)
ZHANG JIAXIANG (CN)
QI QI (CN)
HU HEHE (CN)
LI FEIFEI (CN)
HUANG JIE (CN)
HE JIAYU (CN)
Application Number:
PCT/CN2022/128740
Publication Date:
May 10, 2024
Filing Date:
October 31, 2022
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
G02F1/133; H01L23/498
Foreign References:
| CN114823608A | 2022-07-29 | |||
| CN114509884A | 2022-05-17 | |||
| CN109686719A | 2019-04-26 | |||
| KR20210038512A | 2021-04-07 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT&TRADEMARK AGENT LTD. (CN)
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