CHIP PREPARATION METHOD AND SYSTEM, AND CHIP

WIPO Patent Application WO/2024/082657

A1

A chip preparation method and system, and a chip, which relate to the technical field of micro-nano fabrication. The method comprises: by means of an exposure mode of laser direct writing, preparing a first bottom circuit of an impedance Josephson parametric amplifier, and a second bottom circuit for testing, so as to obtain a first chip product (201); by means of the exposure mode of laser direct writing, generating on the first chip product a photoresist structure for preparing a Josephson junction (202); from the first chip product, obtaining, by means of cutting, a second chip product where the second bottom circuit is located, and a third chip product where the first bottom circuit is located (203); on the basis of a photoresist structure corresponding to the second bottom circuit, trial-producing a Josephson junction sample, so as to obtain an oxidation condition (204); according to the oxidation condition and on the basis of a photoresist structure corresponding to the first bottom circuit, preparing the Josephson junction, so as to obtain a fourth chip product (205); and on the basis of the fourth chip product, acquiring a target chip product (206).

HU JINGJING (CN)
DAI MAOCHUN (CN)
AN SHUOMING (CN)
ZHANG WENLONG (CN)
LI DENGFENG (CN)
ZHANG SHENGYU (CN)

PCT/CN2023/099811

April 25, 2024

June 13, 2023

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TENCENT TECH SHENZHEN COMPANY LIMITED (CN)

H03F7/04; G03F7/20

BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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