Title:
CHIP CLASSIFICATION METHOD AND PACKAGING METHOD, AND CHIP CLASSIFICATION SYSTEM AND PACKAGING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/173446
Kind Code:
A1
Abstract:
Provided in embodiments of the present disclosure are a chip classification method and packaging method, and a chip classification system and packaging system. The classification method comprises: obtaining electrical property test data of at least one wafer; according to the electrical property test data of the wafer, dividing chips on the wafer into groups by using a clustering analysis algorithm, to obtain a group to which each chip belongs, and establishing a clustering model; for each group, extracting a feature set of each group by using a principal component analysis algorithm, and establishing a principal component analysis model; grading the chips in the groups according to scores of the chips in each group on a preset number of features in the feature set, to obtain a grade to which each chip belongs; and obtaining a classification result of the chips according to the group and grade to which each chip belongs.
Inventors:
LIN CHIA-SHENG (CN)
Application Number:
PCT/CN2022/081977
Publication Date:
September 21, 2023
Filing Date:
March 21, 2022
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
B07C5/344; H01L21/67
Foreign References:
| CN102236070A | 2011-11-09 | |||
| CN113594064A | 2021-11-02 | |||
| CN102039277A | 2011-05-04 | |||
| CN113342906A | 2021-09-03 |
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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