Title:
CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/091101
Kind Code:
A1
Abstract:
Provided are: chemical mechanical polishing cerium oxide particles; and a chemical mechanical polishing slurry composition containing same. Provided are the chemical mechanical polishing slurry composition and a method for manufacturing a semiconductor device by using same, the composition comprising, in a combination, the characteristic cerium oxide particles of the present invention, a cationic polymer and a polysilicon polishing inhibitor, thereby enabling an oxide film polishing rate to be improved while maximizing, during STI polishing, silicon oxide film/polysilicon film selectivity.
Inventors:
LEE JEONG HO (KR)
KIM SEOK JOO (KR)
KIM SEOK JOO (KR)
Application Number:
PCT/KR2023/017051
Publication Date:
May 02, 2024
Filing Date:
October 30, 2023
Export Citation:
Assignee:
SOULBRAIN CO LTD (KR)
International Classes:
C09G1/02; C01F17/235; C09K3/14; H01L21/306; H01L21/3105
Foreign References:
| KR20220029512A | 2022-03-08 | |||
| KR20140133604A | 2014-11-19 | |||
| US20220332977A1 | 2022-10-20 | |||
| KR20210018607A | 2021-02-18 | |||
| KR20100011030A | 2010-02-03 |
Attorney, Agent or Firm:
JIDAM IP LAW FIRM (KR)
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