Title:
CAVITY-BACKED MICROSTRIP DIPOLE ANTENNA
Document Type and Number:
WIPO Patent Application WO/2024/090631
Kind Code:
A1
Abstract:
This cavity-backed microstrip dipole antenna array may comprise a printed circuit board (PCB) and a metal substrate. The PCB may comprise: a dielectric substrate; a ground disposed on a second surface of the dielectric substrate, the ground including a first open area, a second open area, and a third open area; radiators disposed in the first open area on the second surface of the dielectric substrate, a first end of each of the radiators being connected to a part of the ground; a microstrip feeder disposed on a first surface of the dielectric substrate, a part of the ground being electrically coupled to the microstrip feeder; and a conductive pattern disposed on the second surface of the dielectric substrate, the conductive pattern being electrically coupled to a second end of each of the radiators.
Inventors:
HONG YOUNGTAEK (KR)
CHO ILNAM (KR)
JUNG BYUNGWOON (KR)
CHOI WOOCHEOL (KR)
CHO ILNAM (KR)
JUNG BYUNGWOON (KR)
CHOI WOOCHEOL (KR)
Application Number:
PCT/KR2022/016755
Publication Date:
May 02, 2024
Filing Date:
October 28, 2022
Export Citation:
Assignee:
LG ELECTRONICS INC (KR)
International Classes:
H01Q9/06; H01Q1/38; H01Q21/06
Foreign References:
| KR101791436B1 | 2017-11-02 | |||
| KR100207600B1 | 1999-07-15 | |||
| US6263193B1 | 2001-07-17 | |||
| US20130169494A1 | 2013-07-04 | |||
| US5025264A | 1991-06-18 |
Attorney, Agent or Firm:
PARK, Jang-Won (KR)
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