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Patent Searching and Data


Title:
BUNDLED-TYPE DYE, PREPARATION METHOD FOR BUNDLED-TYPE DYE, AND PHOTORESIST MIXTURE
Document Type and Number:
WIPO Patent Application WO/2022/141152
Kind Code:
A1
Abstract:
Provided in the embodiments of the present application are a bundled-type dye, a preparation method for the bundled-type dye, and a photoresist mixture; by means of introducing an alkyl chain coating around the periphery of dye molecules to form a bundled-type dye, the aggregation of dye molecules can be effectively prevented, and the severe stacking caused by the relatively large acting force of π-π attraction between dye molecules can be improved, thereby eliminating the impact thereof on the optical path. In addition, the introduction of alkoxy chains can weaken the scattering effect on light during colour film filtering, thereby enhancing the display quality.

Inventors:
AI LIN (CN)
MENG HONG (CN)
Application Number:
PCT/CN2020/141229
Publication Date:
July 07, 2022
Filing Date:
December 30, 2020
Export Citation:
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Assignee:
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
C09B47/18; C09D4/02; C09D4/06; C09D7/63
Foreign References:
CN111978757A2020-11-24
CN111334065A2020-06-26
CN102408745A2012-04-11
CN111258182A2020-06-09
CN111303663A2020-06-19
CN111427235A2020-07-17
JPH09282709A1997-10-31
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
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