Title:
BONDING STRUCTURE OF HETEROGENEOUS SUBSTRATES, MANUFACTURING METHOD THEREFOR, AND ELASTIC WAVE DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/080427
Kind Code:
A1
Abstract:
In order to achieve the objective, the subject matters of the present invention are a bonding structure of heterogeneous substrates, a manufacturing method therefor, and an elastic wave device using same. In the bonding structure in which a first substrate and a second substrate on the first substrate are bonded, the second substrate being different from the first substrate, a groove is formed in a partial region of the bonding structure, a through-portion is formed in a partial region of the bonding structure, the second substrate is separated to form a separation portion, or two or more of the groove, the through-portion, and the separation portion are formed in combination, so that when the first substrate and the second substrate are bonded, diffusion of defects is limited by the groove, the through-portion, or the separation portion.
Inventors:
JUN DONG HWAN (KR)
KIM SHIN KEUN (KR)
JUNG SANG HYUN (KR)
KIM CHANG HWAN (KR)
KIM SHIN KEUN (KR)
JUNG SANG HYUN (KR)
KIM CHANG HWAN (KR)
Application Number:
PCT/KR2022/016094
Publication Date:
April 18, 2024
Filing Date:
October 20, 2022
Export Citation:
Assignee:
KOREA ADVANCED NANO FAB CENTER (KR)
International Classes:
H03H9/02; H03H3/08; H10N30/07; H10N30/20
Foreign References:
| KR20140043457A | 2014-04-09 | |||
| JP2004256380A | 2004-09-16 | |||
| JP2003008094A | 2003-01-10 | |||
| KR20120048467A | 2012-05-15 | |||
| KR20210131429A | 2021-11-02 |
Attorney, Agent or Firm:
LEE, Joon Sung (KR)
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