Title:
COPPER/CERAMIC BONDED SUBSTRATE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/176046
Kind Code:
A1
Abstract:
A copper/ceramic bonded substrate comprising a ceramic substrate and a copper plate bonded to at least one surface of the ceramic substrate, wherein the Vickers hardness of the copper plate is 42.5 HV or less, and the copper plate has a magnesium content of 1 ppm or less, a nickel content of 2.5 ppm or less, a tin content of 0.05 ppm or less, a selenium content of 0.3 ppm or less, a tellurium content of 0.07 ppm or less, and a bismuth content of 0.2 ppm or less.
Inventors:
YUKI SEIYA (JP)
TERAMOTO YUKI (JP)
TERAMOTO YUKI (JP)
Application Number:
PCT/JP2022/043043
Publication Date:
September 21, 2023
Filing Date:
November 21, 2022
Export Citation:
Assignee:
DOWA METALTECH CO LTD (JP)
International Classes:
C04B37/02; B23K35/30; C22C5/06; C22C9/00
Domestic Patent References:
| WO2018221493A1 | 2018-12-06 |
Foreign References:
| JP2021518669A | 2021-08-02 | |||
| JP2006282417A | 2006-10-19 | |||
| JPH0769750A | 1995-03-14 |
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
Download PDF:
Previous Patent: COPPER/CERAMIC BONDED SUBSTRATE AND PRODUCTION METHOD THEREFOR
Next Patent: LASER WELDING DEVICE AND LASER WELDING METHOD
Next Patent: LASER WELDING DEVICE AND LASER WELDING METHOD