Title:
BLOCK COPOLYMER–CONTAINING BLOCK COPOLYMER COMPOSITION, BLOCK COPOLYMER RESIN COMPOSITION, MOLDED ARTICLE, SHEET, AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/157557
Kind Code:
A1
Abstract:
Provided is a block copolymer composition that can prevent a decrease in the transparency of an obtained resin composition while maintaining a characteristic which imparts shock resistance when fellow transparent resins that are normally incompatible are mixed together; that contains a vinyl aromatic hydrocarbon monomer unit and a conjugated diene monomer unit at a mass ratio of 70/30 to 50/50; and that has an active oxirane oxygen concentration calculated from an epoxy equivalent measured in accordance with JIS K7236:2001 of 0.05 to 0.5 mass%. Further provided are a block copolymer resin composition containing the block copolymer composition, as well as a sheet, a film, and a molded article molded from a molding material containing the block copolymer resin composition.
Inventors:
NAKANISHI SOICHIRO (JP)
NAKAMURA YUYA (JP)
SAWASATO TADASHI (JP)
NAKAMURA YUYA (JP)
SAWASATO TADASHI (JP)
Application Number:
PCT/JP2023/001578
Publication Date:
August 24, 2023
Filing Date:
January 19, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L53/02; C08F8/08; C08F297/04; C08L67/02
Domestic Patent References:
| WO2005010096A1 | 2005-02-03 |
Foreign References:
| JPH04100809A | 1992-04-02 | |||
| JPH08253656A | 1996-10-01 | |||
| JP2002030205A | 2002-01-31 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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