Title:
BLOCK COPOLYMER COMPOSITION, RESIN COMPOSITION CONTAINING BLOCK COPOLYMER COMPOSITION, HEAT-SHRINKABLE FILM
Document Type and Number:
WIPO Patent Application WO/2024/048506
Kind Code:
A1
Abstract:
Provided is a block copolymer composition that makes it possible to obtain a heat-shrinkable film that can be separated by specific gravity using water even if the heat-shrinkable film is not foamed when obtaining a heat-shrinkable film from a resin composition containing the block copolymer composition. Provided is a block copolymer composition containing one or more block copolymers that include a vinyl aromatic monomer unit and a conjugated diene monomer unit. When the total mass of the vinyl aromatic monomer units and the conjugated diene monomer units is taken to be 100 mass%, the block copolymer composition contains from 52 mass% to 69 mass% of the vinyl aromatic monomer units. The block copolymer composition has a flexural modulus measured according to ISO 178 of 1000 MPa or more, and the block copolymer composition has at least one peak in the loss tangent (tan δ) range of from 80°C to 110°C when dynamic viscoelasticity measurement is performed by a fixed three-point bending mode at a heating rate of 4°C/min, a frequency of 1 Hz, and a bend of 0.02% according to ISO 6721-1.
Inventors:
NAKAMURA YUYA (JP)
SAWASATO TADASHI (JP)
SAWASATO TADASHI (JP)
Application Number:
PCT/JP2023/030927
Publication Date:
March 07, 2024
Filing Date:
August 28, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08F293/00; C08L53/02
Domestic Patent References:
| WO2008117591A1 | 2008-10-02 | |||
| WO2002038642A1 | 2002-05-16 |
Foreign References:
| JP2004027029A | 2004-01-29 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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