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Patent Searching and Data


Title:
BLOCK COPOLYMER, COMPOSITION, HEAT SHRINKABLE FILM, SHEET AND SHEET MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/105810
Kind Code:
A1
Abstract:
The present invention provides, as a block copolymer having a high tensile elongation value and less foreign gel substances, a block copolymer which comprises a first vinyl aromatic block that is substantially configured only from the vinyl aromatic monomer unit, a second vinyl aromatic block that is substantially configured only from the vinyl aromatic monomer unit, and a copolymer block. With respect to this block copolymer, the second vinyl aromatic block has a weight average molecular weight that is not more than the weight average molecular weight of the first vinyl aromatic block; the copolymer block is substantially configured only from the vinyl aromatic monomer unit and the conjugated diene monomer unit; the content ratio of the conjugated diene monomer unit in the copolymer block is 55% by mass to 82% by mass; the proportion of the first vinyl aromatic block is 50% by mass to 85% by mass if the total mass of the first vinyl aromatic block and the second vinyl aromatic block is taken as 100% by mass; the content ratio of the copolymer block in the block copolymer is 38% by mass to 60% by mass; and the loss tangent value (tanδ) has at least one peak within the range from -70°C to -35°C if dynamic viscoelasticity measurement is carried out under specific conditions.

Inventors:
NAKAMURA YUYA (JP)
SAWASATO TADASHI (JP)
YOSHIDA JUN (JP)
Application Number:
PCT/JP2022/012791
Publication Date:
June 15, 2023
Filing Date:
March 18, 2022
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L53/00; C08F297/04
Foreign References:
JP2011094073A2011-05-12
JP2010235666A2010-10-21
JP2010174166A2010-08-12
JP2005105048A2005-04-21
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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