Title:
BLIND VIA DRILLING METHOD, DEVICE, APPARATUS AND SYSTEM BASED ON SELECTIVE LASER ABSORPTION
Document Type and Number:
WIPO Patent Application WO/2023/201860
Kind Code:
A1
Abstract:
A blind via drilling method based on selective laser absorption. The method comprises: performing windowing and etching on a conductive material layer on one side by using a windowing laser beam spot, so as to expose an intermediate insulating material layer (2); and making a cleaning laser beam spot to perform punching or rotary cutting scanning on the intermediate insulating material layer exposed in a window until an inner surface of a conductive material layer on the other side is exposed. By means of the method, the difference between laser plasma shielding clouds generated when a composite laminated material reacts with a laser is used; a windowing laser beam (12) can efficiently complete the windowing of a conductive material layer; a cleaning laser beam (22) generates a laser plasma shielding cloud on the surface of the conductive material layer; the cleaning laser beam can efficiently complete the removal of an insulating medium which can only be efficiently removed at high quality by carbon dioxide laser at present; and the laser plasma shielding cloud can make the cleaning laser beam to not damage or cause less damage to a conductive material layer at the bottom of a blind via. Further provided are a blind via drilling device, apparatus and system based on selective laser absorption.
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Inventors:
ZHANG LIGUO (CN)
Application Number:
PCT/CN2022/097754
Publication Date:
October 26, 2023
Filing Date:
June 09, 2022
Export Citation:
Assignee:
WUHAN EXCEL SCIENCE AND TECH LTD EST (CN)
International Classes:
B23K26/16; B08B7/00; B23K26/386; B23K26/70
Domestic Patent References:
| WO2002055255A1 | 2002-07-18 |
Foreign References:
| CN114523196A | 2022-05-24 | |||
| CN113001045A | 2021-06-22 | |||
| CN214518290U | 2021-10-29 | |||
| CN110695549A | 2020-01-17 | |||
| CN109640524A | 2019-04-16 | |||
| CN109640526A | 2019-04-16 | |||
| JP2003204137A | 2003-07-18 | |||
| DE19719700A1 | 1998-11-12 |
Attorney, Agent or Firm:
KEYCOM PARTNERS, P.C. (CN)
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