TECHNICAL FIELD

The present subject matter in general relates to automatic processing of gemstones and in particular relates to an autonomous apparatus and method for processing gemstones.

BACKGROUND

Gemstones are naturally occurring deposits of minerals and include, for example, diamonds, quartz, opals, sapphires, rubies, emeralds, and topaz. Typically, gemstones are found in their natural state and have highly irregular geometry. Since the gemstones are rare, they are highly valued for use. The value grade, also referred to as commercial quality, of a gemstone is generally assessed in accordance with weight, cut, clarity, color, luster and finish of the gemstone. The value of a gemstone is also derived from manner in which it transmits, refracts, or reflects rays of light.

For assessing the quality of a gemstone, the amount and type of impurities in the gemstone are determined at an atomic level within the crystal lattice of carbon atoms. Based on the amount and type of impurities in a gemstone, diamonds are generally graded into four basic types, namely type la, lb, Ila, and lib, and each grade is accordingly associated with a different range of commercial value.

In order to obtain the best properties of a gemstone, it undergoes a series of processes like planning, marking, cutting, bruting, faceting, conning, and polishing. The processing of a gemstone imparts certain characteristics to the gemstone. For example, the value of a processed gemstone is generally determined by the 4Cs, i.e., carat (weight), clarity (transparency), color, and cut, which are directly or indirectly affected by the processing techniques. Therefore, techniques for effective gemstone processing have been areas of active research.

Further, a rough gemstone may include structural imperfections, which may cause damage to the gemstone while processing, thereby causing wastage of precious gemstones. Such imperfections can include, for example, cracks, cleavages, knots, small included crystals of different orientation with respect to the rest of the stone, or other internal physical defects in some regions of the body. Usually, presence of structural imperfections within a gemstone is identified during planning phase in which further processing of the gemstone is planned. In the planning operation, the rough gemstone is mapped to develop a three-dimensional (3D) model depicting deformities and cavities on the gemstone's surface. The 3D model of the rough gemstone is also used to determine the number of final or planned gemstones, which can be produced from a rough gemstone. The 3D model of the rough gemstone also determines the geometry of each final gemstone, thus produced. During the planning stage, the number, size and geometry of the final gemstones is determined keeping in mind the quality of final gemstones to be obtained and at the same time ensuring least wastage of the gemstone material.

The rough gemstone undergoes a cutting operation once the planned data from the planning stage is obtained. In the cutting operation, the rough gemstone is cut into multiple pieces based on the determined geometry of final gemstones to be produced. These cut pieces of the rough gemstone then undergo other processing steps before being polished in the final polishing step to obtain the final gemstones.

Cutting of rough gemstones also depends on the structure and hardness of the rough gemstone. Laser cutting technique is usually employed for cutting and shaping of gemstones nowadays. Generally, a gemstone cutting apparatus based on the laser cutting technique employs a laser as a source for cutting the gemstones.

Conventional gemstone processing machines, particularly gemstone cutting machines, are manually operated in which a user loads the rough gemstones into the cutting machine and sets a cutting plan obtained from the planning step. The cutting machine then performs the cutting operation based on the cutting plan identified by the user. However, the conventional gemstone processing machines require manual intervention of the user at regular intervals while the machine is in operation. Further, the existing gemstone cutting machines can process one gemstone at a time and the user operating said machines is forced to sit idle and constantly monitor operation of the machines while cutting of the gemstone is in progress. Therefore, cutting process in conventional gemstone cutting machines is labor intensive, time-consuming and less efficient, which also limits the throughput of the gemstone processing machine. Moreover, for holding and locating a rough gemstone in a gemstone cutting machine, the rough gemstone is generally mounted on a gemstone holder. This gemstone holder containing the rough gemstone is placed in the processing station of the gemstone cutting machine so that the cutting operation of the gemstone can be initiated. In conventional gemstone cutting machines, once a rough gemstone mounted on the gemstone holder is cut to obtain one or more gemstones for further processing like bruting, shaping polishing etc., the cut gemstones are dropped at a designated location in the gemstone cutting machine, from where the cut gemstones are either picked up manually or conveyed to another machine for further processing. Subsequently or simultaneously, the gemstone holder on which the rough gemstone was mounted before cutting is also dropped at another location. Thereafter, the cut gemstones as well as gemstone holder are collected either manually or conveyed to a desired location.

However, sometimes it becomes difficult to track and correlate the final cut gemstones with the rough gemstone from which these gemstones were derived. Further, conventional gemstone processing, especially gemstone cutting, requires dependency on skilled operators. Furthermore, there is a scope to improve the quality of final gemstones upon their processing in gemstone processing machines, preferably gemstone cutting machines. Furthermore, the existing gemstone processing machines require high operating and maintenance cost. Moreover, collection of one or more final gemstones as well as the gemstone holder after performing the cutting operation in a cutting machine is inefficient and time consuming, thereby further affecting the throughput of the gemstone. It may also be required to correlate the final gemstones cut from a gemstone holder. However, conventional gemstone cutting machines do not have this option and such correlation, if any, is possible only manually. Even if conventional gemstone processing machines are modified or configured to track the gemstones cut from a gemstone holder, such tracking techniques would be inefficient, time consuming and prone to error as they still would require human intervention.

As can be seen from above, since the steps involved in the gemstone processing are manualskill intensive and prone to errors, the entire techniques of gemstone processing and collection after cutting are low on productivity. Also, gemstone cutting process results in high heat build-up at the location of impingement of the laser beam on the rough gemstone. Therefore, a cooling mechanism is generally employed during the gemstone cutting process. However, conventional cooling mechanisms are either less effective or require manual intervention. Moreover, the conventional cooling mechanisms require a large amount of space for efficiently performing the cooling operation which the gemstone is getting processed. Any compromise in the cooling process during gemstone cutting may result in incorrect cutting, thereby resulting in rejection of final gemstones and wastage of precious gemstone material.

In view of the above, a heretofore unaddressed need exists in the industry to address the aforementioned deficiencies and inadequacies.

SUMMARY

An object of the present subject matter is to provide an efficient system and method for cutting of rough gemstones in a cutting apparatus and collecting one or more cut gemstones from the cutting location.

Another object of the present subject matter is to provide an autonomous gemstone cutting apparatus in which collection of one or more cut gemstones derived from a rough gemstone as well as the gemstone holder on which the rough gemstone was attached before performing the cutting operation is efficiently and simultaneously done.

Yet another object of the present subject matter is to provide an autonomous gemstone cutting apparatus in which one or more cut gemstones from a rough gemstone as well as the gemstone holder on which the rough gemstone was attached before performing the cutting can be efficiently and automatically correlated, tracked and tagged together.

Yet another object of the present subject matter is to provide an autonomous gemstone cutting apparatus in which cutting of a rough gemstone is efficiently performed with minimum requirements of setting and adjusting the gemstone.

Yet another object of the present subject matter is to provide an autonomous gemstone cutting apparatus that automatically performs the steps of transferring one or more rough gemstones to a cutting location, cutting said one or more rough gemstones and delivering the cut gemstones as well as corresponding gemstone holders from the cutting location to a delivery station without any manual intervention. Yet another object of the present subject matter is to provide an autonomous gemstone cutting apparatus that is capable of cutting multiple rough gemstones automatically without any idling time required for monitoring operation of the cutting apparatus.

Yet another object of the present subject matter is to provide an autonomous gemstone cutting apparatus having high throughput.

Yet another object of the present subject matter is to provide an autonomous gemstone cutting apparatus in which one or more cut gemstones as well as the gemstone holder on which the rough gemstone was mounted before cutting are automatically collected together and associated with each other.

Yet another object of the present subject matter is to provide an autonomous gemstone cutting apparatus that is capable of performing efficient and time saving process of collection of one or more final gemstones as well as the gemstone holder after performing the cutting operation.

Yet another object of the present subject matter is to reduce dependency on skilled operators for gemstone processing.

Yet another object of the present subject matter is to reduce idle sitting time of an operator of a gemstone processing apparatus.

Yet another object of the present subject matter is to increase productivity of the gemstone processing apparatus and process, preferably gemstone cutting apparatus and process.

Yet another object of the present subject matter is to increase the quality of one or more final gemstones upon processing of a rough gemstone in a gemstone processing machine and process , preferably a gemstone cutting machine and process.

Yet another object of the present subject matter is to reduce the operating cost of a gemstone processing machine and process, preferably gemstone cutting machine and process.

Yet another object of the present subject matter is to reduce the heat build-up substantially and efficiently during processing of a gemstone in a gemstone processing apparatus, preferably gemstone cutting apparatus. The present subject matter relates to an autonomous gemstone processing apparatus comprising: a processing station for sequentially processing a plurality of raw gemstones mounted on gemstone holders, the processing station comprising a fixture for mounting the gemstone holder containing the raw gemstone; at least one laser light source for processing the raw gemstone; and a dual camera assembly for monitoring the processing operation of the raw gemstone.

In an embodiment, the autonomous gemstone processing apparatus comprises a gemstone cutting apparatus.

In another embodiment, the fixture comprises a cutting fixture, the cutting fixture comprising a rotatable member configured to rotate about Y-axis, and a gemstone mounting unit configured to mount and rotate the gemstone holder in Z-axis during cutting process.

In yet another embodiment, the fixture is configured to orient from 0 degrees to 120 degrees, preferably 0 degrees to 90 degrees, for processing the gemstone.

In yet another embodiment, the processing station comprises a collection bin configured to cover the gemstone, the collection bin being configured to transfer one or more cut pieces of the gemstone obtained from cutting of the raw gemstone to a conveyor assembly when the fixture is oriented at 90 degrees.

In yet another embodiment, the collection bin comprises a slot for providing an opening for the cutting laser to cut the raw gemstone, a spring-loaded flapper for enabling mounting of the gemstone holder containing raw gemstone on the fixture for performing cutting operation and dismounting the gemstone holder from the fixture after the cutting operation is complete.

In yet another embodiment, the dual camera assembly comprises a cutting vision camera configured to capture a plurality of images of the raw gemstone during the cutting process.

In yet another embodiment, the cutting vision camera is mounted on a cutting vision camera mounting. In yet another embodiment, the cutting vision camera is mounted vertically above the processing station for capturing images of the gemstone.

In yet another embodiment, the autonomous gemstone processing apparatus further comprises a focal lens mount for focusing the laser cutting beam on the raw gemstone during the cutting process and allowing the cutting vision camera to view and capture images of the raw gemstone through it.

In yet another embodiment, the dual camera assembly comprises a secondary vision camera configured to capture images of the gemstone when the fixture shifts in horizontal direction to move the fixture under the secondary vision camera.

In yet another embodiment, the secondary vision camera is mounted on a secondary vision camera mounting.

In yet another embodiment, the autonomous gemstone processing apparatus further comprises a cooling assembly comprising one or more air nozzles for reducing the heat generated in the working station during cutting operation.

In yet another embodiment, the one or more air nozzles are configured to move between an operating position in which the one or more air nozzles are directed towards the gemstone during cutting operation and a rest position in which the one or more air nozzles are directed away from the gemstone.

In yet another embodiment, the cooling assembly further comprises one or more operating mechanisms to rotate the air nozzles from the operating position to the rest position and vice versa.

In yet another embodiment, the one or more operating mechanisms comprises a belt and pulley arrangement.

In yet another embodiment, the dual camera assembly is configured for cutting detection and dual monitoring by the dual camera assembly is performed for smart match process.

A method for processing a gemstone is also provided, the method comprising: mounting a gemstone holder containing a raw gemstone on a fixture of a processing station; directing a laser light source on the gemstone for processing the raw gemstone; and capturing a plurality of images of the raw gemstone by a dual camera assembly for monitoring the cutting operation of the raw gemstone during gemstone processing.

In an embodiment, the step of capturing the plurality of images of the raw gemstone comprises: continuously capturing images of the raw gemstone by a cutting vision camera through one or more focal lens during processing of the raw gemstone; shifting, once the cutting detection is confirmed by the cutting vision camera, the fixture carrying the cut gemstone below a secondary vision camera; capturing images of the cut gemstone by the secondary vision camera; shifting the fixture carrying the gemstone below the cutting vision camera if the cutting detection is not confirmed by the secondary vision camera to repeat the above steps; and confirming completion of the cutting process if the cutting detection is confirmed by the secondary vision camera.

BRIEF DESCRIPTION OF ACCOMPANYING DRAWINGS

The present invention, both as to its organization and manner of operation, together with further objects and advantages, may best be understood by reference to the following description, taken in connection with the accompanying drawings. These and other details of the present invention will be described in connection with the accompanying drawings, which are furnished only by way of illustration and not in limitation of the invention, and in which drawings:

Figure 1 illustrates an isometric view of an autonomous gemstone processing apparatus in accordance with one embodiment of the present subject matter.

Figure 1A illustrates an isometric view of the autonomous gemstone processing apparatus depicting a dual camera assembly in accordance with one embodiment of the present subject matter.

Figure 2 illustrates a perspective view of a cutting fixture of the autonomous gemstone processing apparatus in the zero position in accordance with one embodiment of the present subject matter. Figure 3 illustrates a perspective view of the cutting fixture of the autonomous gemstone processing apparatus in the zero position with a collection bin mounted thereon in accordance with one embodiment of the present subject matter.

Figures 3A and 3B illustrate perspective views of the cutting fixture of the autonomous gemstone processing apparatus in operating position in accordance with one embodiment of the present subject matter.

Figure 4 illustrates a perspective view of the combination of the secondary camera and the colling assembly of the autonomous gemstone processing apparatus in accordance with one embodiment of the present subject matter.

Figures 5A to 9 illustrate different views of the autonomous gemstone processing apparatus depicting the cooling assembly comprising an air nozzle assembly in the operating position in accordance with one embodiment of the present subject matter.

Figures 10 to 15 illustrate different views of autonomous gemstone processing apparatus depicting the cooling assembly comprising the air nozzle assembly in the rest position in accordance with one embodiment of the present subject matter.

DETAILED DESCRIPTION

The following presents a detailed description of various embodiments of the present subject matter with reference to the accompanying drawings.

The embodiments of the present subject matter are described in detail with reference to the accompanying drawings. However, the present subject matter is not limited to these embodiments which are only provided to explain more clearly the present subject matter to a person skilled in the art of the present disclosure. In the accompanying drawings, like reference numerals are used to indicate like components.

The specification may refer to "an", "one", "different" or "some" embodiment(s) in several locations. This does not necessarily imply that each such reference is to the same embodiment(s), or that the feature only applies to a single embodiment. Single features of different embodiments may also be combined to provide other embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless expressly stated otherwise. It will be further understood that the terms "includes", "comprises", "including" and/or "comprising" when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "attached" or "connected" or "coupled" or "mounted" to another element, it can be directly attached or connected or coupled to the other element or intervening elements may be present. As used herein, the term "and/or" includes any and all combinations and arrangements of one or more of the associated listed items.

The figures depict a simplified structure only showing some elements and functional entities, all being logical units whose implementation may differ from what is shown.

The present invention relates to an autonomous gemstone processing apparatus that is configured to process rough gemstones with a minimum input of an operator. For the purpose of the present description, the expressions 'rough gemstone' and 'raw gemstone' are used interchangeably. According to a preferred embodiment, the autonomous gemstone processing apparatus comprises an autonomous gemstone cutting apparatus. However, in another embodiment, the autonomous gemstone processing apparatus may comprise an apparatus configured to perform one or more other processes, including but not limited to gemstone bruting, gemstone shaping etc.

A raw gemstone in its natural state may be divided into two or more final gemstones depending on the geometry of each final gemstone identified during the planning process. The autonomous gemstone cutting apparatus according to the present subject matter is configured to cut a raw gemstone into multiple pieces for producing multiple final gemstones from said raw gemstone. The present autonomous gemstone cutting apparatus is also configured to remove undesired material from a raw gemstone when a single gemstone as identified during the planning process is desired from the raw gemstone.

The autonomous gemstone processing apparatus according to the present subject matter, among other benefits, eliminates the need for constant monitoring of gemstone processing by an operator and allows one operator to operate multiple gemstone processing apparatuses simultaneously. In an embodiment, an average operator can operate up to four such autonomous gemstone processing apparatuses simultaneously without any interruption. In another embodiment, an operator may be able to operate more than or less than four autonomous gemstone processing apparatuses without deviating from the scope of the present subject matter.

While the present embodiment is described with reference to a gemstone cutting apparatus as the autonomous gemstone processing apparatus, it would be understood that the autonomous gemstone processing apparatus can be configured as an apparatus used in other processing steps of a gemstone, such as a gemstone bruting apparatus, a gemstone faceting apparatus, a gemstone polishing apparatus etc., without deviating from the scope of the present subject matter. Further, in different embodiments, the cutting line can be straight, curved, multi point, circular, semi-circular, etc. Furthermore, cutting operation can be through cut, blind cut, etc. in different embodiments.

Figures I to 15 illustrate different components of an autonomous gemstone cutting apparatus 10 in accordance with an embodiment of the present subject matter. Perspective views of the autonomous gemstone cutting apparatus 10 are depicted in Figures 1 and 1A in a preferred embodiment of the present subject matter. In particular, while Figure 1 illustrates the autonomous gemstone cutting apparatus 10 depicting various major components of the apparatus along with a secondary camera of the dual camera assembly, Figure 1A depicts the configuration and placement of major components of the dual camera assembly in the autonomous gemstone cutting apparatus 10 in a preferred embodiment.

As shown herein, the autonomous gemstone cutting apparatus 10 comprises a plurality of components. For example and by no way limiting the scope of the present subject matter, the autonomous gemstone processing apparatus 10 comprises a conveyor assembly 20 for conveying a plurality of gemstone holders containing raw gemstones from a feed area or loading area to a discharge area. In a preferred embodiment, the conveyor assembly 20 comprises a conveyor belt driven by a set of pulleys to convey gemstones from the loading area to the discharge area. The autonomous gemstone processing apparatus 10 further comprises a transfer station, preferably comprising a robotic arm 30, for transferring the gemstone holders containing raw gemstones from the conveyor assembly 20 to a processing station 40 and vice versa. In a preferred embodiment, the robotic arm 30 is configured to move in vertical direction and to rotate about its central vertical axis. In a preferred embodiment, the robotic arm 30 comprises a gemstone carrying mechanism on its either end for carrying the plurality of gemstone holders containing raw gemstones from the conveyor assembly 20 to the processing station 40 and for transferring the gemstone holder as well as the cut pieces of the raw gemstone from the processing station 40 back to the conveyor assembly 20.

In a preferred embodiment, the processing station 40 comprises a cutting fixture 100 on which the gemstone holder (not shown) containing the raw gemstone is mounted for performing the cutting operation on said raw gemstone. In a preferred embodiment, the fixture is configured to orient from 0 degrees to 120 degrees, preferably between 0 degrees to 90, degrees for processing the gemstone. The autonomous gemstone processing apparatus 10 according to the present subject matter further comprises a transfer member, preferably a collection bin 200, for transferring one or more separated pieces of the cut gemstone from the processing station 40 to the conveyor assembly 20 after completion of the cutting operation. The autonomous gemstone processing apparatus 10 further comprises a control unit comprising one or more processors for operating the components, assemblies, and subassemblies of the conveyor system, the transport station and the gemstone processing station.

As shown in Figures 1A and IB, the autonomous gemstone processing apparatus 10 comprises a dual camera assembly 50 that is communicably connected to a control unit (not shown) for monitoring the cutting process in the processing station 40. The dual camera assembly 50 comprises a pair of cameras for capturing a plurality of images of the raw gemstone during the cutting process at different time periods to ensure that optimum cutting of the raw gemstone takes place. The dual camera assembly 50 according to the present subject matter comprises a cutting vision camera 52, a cutting vision camera mount 54, a secondary vision camera 56 and a secondary vision camera mount 58. In a preferred embodiment, the cutting vision camera mount 54 and the secondary vision camera mount 58 are configured to firmly support the cutting vision camera 52 and the cutting vision camera mount 54 respectively at right angles. As shown in Figure IB, in a preferred embodiment, the cutting vision camera 52 is positioned in the horizontal configuration for continuously capturing a plurality of images of the raw gemstone from the top while the cutting operation of a raw gemstone by a laser beam in the processing station 40 is in progress. In a preferred embodiment, the autonomous gemstone processing apparatus 10 comprises a focal lens mount 60 for focusing the laser cutting beam on the raw gemstone during the cutting process. In a preferred embodiment, the cutting vision camera 52 is configured to continuously capture images of the gemstone from the top through the focal lens mount 60 when the cutting process is in progress. As the vision of the cutting vision camera 52 through the focal lens mount 60 may not be fully accurate, it is likely that the confirmation of completion of the cutting process determined from the images captured by the cutting vision camera 52 is imprecise.

In order to ensure that the desired and accurate cutting of the raw gemstone is performed, the secondary vision camera 56 is provided. In particular, once the cutting vision camera 52 determines that the cutting operation of the gemstone is complete in the processing station, the assembly containing the focal lens mount 60 is automatically moved upwards by the control unit. Simultaneously or subsequently, the cutting fixture 100 is automatically moved sideways so that the cut gemstone mounted in the processing station is positioned under the secondary vision camera 56 of the dual camera assembly 50. The secondary vision camera 56 as shown in Figures 1A and IB is positioned in the vertical configuration in an embodiment and is configured to capture one or more images or videos of the raw gemstone from the top when the cut gemstone is positioned under the secondary vision camera 56. At this position, the secondary vision camera 56 captures one or more images or videos of the cut gemstone. Once it is ascertained form the images or videos captured by the secondary vision camera 56 that the desired cutting of the gemstone is complete, the cutting process is considered as finished. However, if it is found from the images or videos captured by the secondary vision camera 56 that the cutting operation is still incomplete, the processing station 40 and the focal lens mount 60 attain their cutting position, i.e., the opposition in which cutting of the gemstone is performed by the cutting laser through the focal lens mount 60. At this position, the cutting vision camera 52 again starts to capture images of the gemstone while further cutting of the gemstone is being performed. This process is repeated till the desired cutting of the gemstone is obtained.

Figure 2 illustrates a perspective view of the cutting fixture 100 of the autonomous gemstone cutting apparatus 10 in accordance with one embodiment of the present subject matter. In an embodiment and by no way limiting the scope of the present subject matter, the cutting fixture 100 of the autonomous gemstone cutting apparatus is configured to mount a gemstone holder containing the raw gemstone. The raw gemstone is cut into one or more pieces after said raw gemstone has undergone the planning process in one or more planning apparatuses. During the planning process, the planning apparatus performs marking defining one or more cutting planes on the raw gemstone so that one or more gemstones are derived from the raw gemstone. The cutting fixture 100 according to a preferred embodiment comprises a rotatable member 102 that is configured to rotate about Y-axis (shown in Figure 2) in the direction shown by arrow Rl. The cutting fixture 100 according to a preferred embodiment further comprises a gemstone mounting unit 104 for mounting the raw gemstone. For the purpose of the present description, from an operator's point of view, X- axis is the axis that extend from left to right direction, Y-axis is the axis that extends from back to forward direction and Z-axis is the axis that extends up and down direction, as shown in Figure 2. The cutting fixture 100 further comprises a support member 106 for supporting the components of the cutting fixture 100. In an embodiment, the support member 106 houses a drive for supporting and rotating the rotatable member 102 as required. In an embodiment, the drive inside the support member 106 comprises a motor that is operated by a control unit (not shown).

In a preferred embodiment, the gemstone mounting unit 104 of the cutting fixture 100 is configured to hold and rotate a gemstone holding member or gemstone holder 108 containing the raw gemstone during the cutting operation. In a preferred embodiment, the position of the cutting fixture 100 depicted in Figure 2 is the ready position of said cutting fixture 100. In other words, in the position depicted in Figure 2, the gemstone holder containing the gemstone is either mounted on the gemstone mounting unit 104 before commencement of the cutting operation or removed from the gemstone mounting unit 104 after completion of the cutting operation this position. The position of the rotatable member 102 shown in Figure 2, is considered as a "0 degree" in the present embodiment. As would be clear to a person skilled in the art, the 0 degree of the turntable member 102 is different for every fixture. The 0 degree angle depends upon the mechanical fitting of the motor and one or more homing sensors. However, once the turntable member 102 is assembled, the 0 degree is the same for every time and all the calculations are relative to this 0 degree. The autonomous gemstone cutting apparatus 10 performs the smart-match process, in which the control unit matches the marking lines of the raw gemstone by image processing. After matching the rotatable member 102 is rotated to "90 degree" to bring the gemstone mounting unit 104 in the cutting position for performing the cutting operation. Therefore, before the cutting operation is initiated, the rotatable member 102 is positioned at 0 degree position, as shown in Figure 2, for mounting the gemstone holder carrying the raw gemstone on the gemstone mounting unit 104 either manually or by means of the robotic arm 30. In a preferred embodiment, the gemstone mounting unit 104 houses a drive, such as a motor, for rotating the gemstone holding member 108 about Z-axis during cutting operation in the direction shown by arrow R2, when the rotatable member 102 is at the position of 0 degree. In a preferred embodiment, the drives inside the support member 106 and inside the gemstone mounting unit 104 are connected to the control unit. In an embodiment, these drives are connected to the control unit either wirelessly or may have a wired connection. In the present embodiment, the direction of rotation of the rotatable member 102 and the gemstone holding member 108 is clockwise. However, it would be clear to a person skilled in the art that the direction of rotation of the rotatable member 102 and the gemstone holding member 108 may be in anti-clockwise in another embodiment. In yet another embodiment, the rotations of rotatable member 102 and the gemstone holding member 108 may be in the same direction or in opposite directions.

In an embodiment, a collection bin 200 is mounted on the rotatable member 102 such that collection bin 200 surrounds at least a part of the gemstone mounting unit 104, as depicted in Figure 3, which illustrates a perspective view of the assembly of the cutting fixture 100 and the collection bin 200. Figure 3 represents the pick and place position of the gemstone holding member 108. For cutting the gemstone, the cutting fixture 100 turns by 90 degrees in the clockwise direction and the cutting laser passes through the slot 210 shown in the Figure 3 to perform the cutting operation on the raw gemstone.

In a preferred embodiment, the collection bin 200 surrounds the gemstone holding member 108 such that when the raw gemstone mounted on the gemstone mounting unit 104 is cut by a laser beam, the cut pieces of the raw gemstone fall into the collection bin 200. In an embodiment, the collection bin 200 is configured to collect the cut pieces of the gemstone and transfer these sawed pieces back to the conveyor assembly 20. In an embodiment, the collection bin 200 comprises a slanted bottom surface 201, a funnel 202 and a funnel cap 204 for transferring the cut gemstone pieces of the raw gemstone to the conveyor assembly 20. When the cut pieces of the gemstone fall on the slanted bottom surface 201 of the collection bin 200, the gemstone pieces automatically move towards the funnel 202 due to the downward slope of the slanted bottom surface 201 towards the funnel 202. The spring-loading funnel cap 204 then opens to transfer the cut gemstone pieces to the conveyor assembly 20. In an embodiment, the collection bin 200 further comprises a spring loaded flapper 212 that is configured to rotate about the hinge 213 when the gemstone holder is either placed in the cutting fixture or the gemstone holder is picked up by the robotic arm from the cutting fixture. In an embodiment, a spring mechanism is provided at the hinge 213 for biasing the flapper 212 to close the same. Therefore, the flapper 212 is configured to provide access to the robotic arm to place the raw gemstone along with its holder on the cutting fixture before the cutting process. The spring-loaded flapper also provides access to the robotic arm to pick the gemstone holder after the cutting process has completed. Figures 3 A and 3 B illustrate the rotation of the rotatable member 102 in 90 degrees while the cutting of raw gemstone is taking place. In an embodiment, the collection bin 200 further comprises a removable cap 208 is fitted with a rectangular slab 206. The removable cap 208 along with the rectangular slab 206 is configured for calibration of the gemstone mounting unit 104, which is usually a one-time process.

In a preferred embodiment, during the cutting process, the rotatable member 102 rotates by 90 degrees, as shown in Figures 3A and 3B, and a cutting laser is passed through the slot 210 to cut the raw gemstone mounted on the cutting fixtures into one or more piece. The cut gemstones pieces are then transferred to the conveyor assembly 20 by the means of the slanted bottom section through the funnel 202 and the funnel cap 204.

Before a raw gemstone enters the autonomous gemstone processing apparatus 10, it undergoes a planning process. The planning process of a raw gemstone includes but is not limited to the steps of creating 3D profile of said raw stone, marking cutting planes on said raw stone and determining cutting sequence of the marked raw stone. After the planning process is complete, the raw gemstone is mounted on the autonomous gemstone cutting apparatus by orienting the rotatable member 102 at 0 degree position. Once the rotatable member 102 is at 0 degree position, the gemstone holder 108 containing the raw gemstone is mounted on the gemstone mounting unit 104, preferably by a robotic arm. In a preferred embodiment, the control unit (not shown) according to the present subject matter is configured to receive the planning data from the planning apparatus, compare said planning data with the raw stone mounted in the autonomous gemstone cutting apparatus, perform a smart match of the raw stone in the autonomous gemstone cutting apparatus and correct positioning error, if any, of the raw gemstone mounted in the autonomous gemstone cutting apparatus to pre-defined tolerance value, preferably defined by a user.

According to an embodiment of the present subject matter, the planning data includes but are not limited to the 3D profile of the raw stone, details of cutting planes and cutting sequence identified by the planning apparatus. Once the planning data is imported from the planning machine into the autonomous gemstone cutting apparatus 100 and the raw stone is mounted on the gemstone mounting unit 104, the control unit verifies the positioning, sequence and identity of the raw stone mounted on the gemstone mounting unit 104 in view of the planning data imported from the planning machine and identifies the errors, if any. In a preferred embodiment, said verification is performed by an image processing technique to check for errors, if any. In case an error or mismatch is identified between the raw stone mounted on the gemstone mounting unit 104 and the corresponding planning data imported from the planning machine, the control unit automatically triggers a signal indicating rejection of the mismatching stone. In a preferred embodiment, if the mismatch is identified, the cutting apparatus does not perform subsequent processing steps unless the mismatch has been addressed. The control unit performs the "smart match" process, which is responsible for "matching" the actual raw gemstone and the planning data. If the raw gemstone mounted on the gemstone mounting unit 104 does not match with the planning data imported into the autonomous gemstone cutting apparatus, the control unit rejects the gemstone. In this process, the control unit also fine tunes the coordinate based on image processing technique. Based on the smart match process, the control unit corrects the positioning errors, if any, of the raw gemstone mounted on the gemstone mounting unit 104 up to pre-defined tolerance values. These positioning errors of the raw stone can be corrected by moving the cutting fixture 100 in one or more of X-axis, Y-axis and Z-axis.

The autonomous gemstone cutting apparatus further comprises a cooling assembly for reducing the heat generated in the working station, i.e., the area surrounding the gemstone holding member 108 during cutting operation, as shown in Figures 4 to 15. Figure 4 illustrates a perspective view of assembly of the secondary vision camera 56 and the cooling assembly. As shown herein, the secondary vision camera 56 is mounted on the secondary vision camera mounting 58 besides an opening 306. The opening 306 is configured to accommodate one or more focal lenses 312, 314. The focal lenses 312 and 314 are configured to focus the cutting laser beam on the gemstone during cutting process. A light source 316 is provided to direct light on the gemstone for illuminating said gemstone during cutting operation. In an embodiment, the light source 316 comprises LED light source. The illumination of the gemstone assists the dual camera assembly to capture good quality images of the gemstone during cutting operation. In an embodiment, a motor mount 310 is provided to mount a motor. In a preferred embodiment, the motor mount 310 is configured to absorb shocks and vibrations at the time of operation of the motor. The motor inside the motor mount 310, upon receiving instructions from the control unit, is configured to operate one or more air nozzles 302 of the cooling assembly from the position of rest Pl to the position of operation P2 and vice versa.

In a preferred embodiment, as shown in Figures 4 to 15, the air nozzles 302 of the cooling assembly are connected to a compressed air source and are configured to direct compressed air at low temperature towards the raw gemstone mounted on the gemstone mounting unit 104 to reduce the temperature build up during cutting. According to a preferred embodiment, the air nozzles 302 are movable between an operating position Pl to a rest position P2. However, in another embodiment, the one or more air nozzles 302 can be moved to any other position between Pl and P2. The Rotation R1 of the rotatable member 102, R2 of the gemstone holding means and the air nozzles 302 are sequenced by the control unit in such a manner that they do not collide with each other. In the operating position Pl, as shown in Figures 4 to 9, the outlet of the air nozzles 302 is directed toward the processing station 40 so that the compressed air at low temperature is directed to the raw gemstone mounted on the gemstone mounting unit 104 when the cutting operation is in process. Once the cutting operation is complete or halted, the air nozzles 302 move to the rest position P2, as shown in Figures 10 to 15. In a preferred embodiment, the air nozzles 302 are configured to rotate about Y-axis, i.e., from operator's point of view, the air nozzles 302 are rotated from left to right direction. The Y-axis is shown in Figure 5B. Figures 8 and 9 depict the cutting position Pl of the air nozzles 302 from left and right sides respectively.

For the purpose of illustration, only one air nozzle 302 is depicted in Figures 4 to 15. However, one or more additional air nozzles may be provided for directing the compressed air at low temperature towards the processing station 40. In an embodiment, the air nozzles may be located at an angle above the processing station 40 such that the air nozzles 302 are configured in an inclined orientation during operation, i.e., while directing the compressed air at low temperature towards the processing station 40, as shown in Figures 4 to 7. In another embodiment, the air nozzles 302 may be located in the vertical position above the processing station 40 for directing the compressed air at low temperature towards the processing station 40, as shown in Figures 8 and 9. In the rest position P2, the air nozzles 302 are located in the horizontal plane in a preferred embodiment, as shown in Figures 10 to 15.

While mounting of the raw gemstone on the gemstone mounting unit 104 and during inspection or correction process, the air nozzles 302 are made to move away or rotate from the operating position Pl to the rest position P2. One or more operating mechanisms are provided to rotate the air nozzles 302 from the operating position Pl to the rest position P2. In a preferred embodiment, a belt and pulley arrangement 304, as depicted in Figures 7 to 9 and 13 to 15, is provided for this purpose. In a preferred embodiment, the belt and pulley arrangement 302 is operated by the motor mounted in the motor mount 310, as shown in Figures 4 and 5A. The motor is connected to the control unit so that prior to commencement of the cutting process, the air nozzles 302 automatically move into the operating position Pl to direct the cooling air on the cutting surface of the gemstone in the processing station during cutting operation.

While the present embodiment depicts belt and pulley arrangement for rotating the air nozzles 304 between the operating position Pl to the rest position P2 and vice versa, other operating mechanisms such as gear arrangement may alternately be employed for this purpose. In yet another embodiment, the air nozzles 302 may undergo a different motion, such as sliding motion, when shifting from the operating position Pl to the rest position P2 and vice versa. In an embodiment, individual operating mechanism is provided for each air nozzle. However, in another embodiment, a common operating mechanism may be provided for all air nozzles. In the idle position of the gemstone cutting apparatus 10, i.e., when the cutting operation is not being performed, the air nozzles 302 attain the rest position P2 depicted in Figures 10 to 15. Further, during the cutting operation, it may be necessary to regularly inspect or monitor the partially sawed raw gemstone in multiple iterations. In a preferred embodiment, the automatic cutting machine performs automatic cutting operation on a raw gemstone in multiple iterations if the complete depth is not arrived at in one iteration. The cutting apparatus according to the present subject matter employs the dual camera assembly 50, in which the cutting vision camera 52 is accompanied with the secondary vision camera 56. In a preferred embodiment, both the cutting vision camera 52 and the secondary vision camera 56 are fixed in their positions. In a preferred embodiment, the cutting vision camera is mounted by the cutting vision camera mount 54 vertically above the cutting focal lenses 312 and 314 for continuously monitoring the operation and performing inspection of the raw gemstone during the cutting process as well as when the cutting process is halted for inspection. In a preferred embodiment, the secondary vision camera 56 is also mounted by the secondary vision camera mounting 58 vertically on the back side in the Y-axis of the raw gemstone, so that the secondary vision camera 56 is able to capture images and / or record videos of the gemstone from the top when the processing station 40 shifts and positions itself below the secondary vision camera 56. The cutting vision camera 52 is configured to detect the gemstone cutting process in the initial phase and the secondary vision camera 56 is configured to provide the final confirmation of the process.

The opening 306 provides a clear view of the raw stone in the processing station 40 to the cutting camera 52, as shown in Figures 4, 5, 10 and 11. During the cutting detection process, the air nozzles 302 retain their position towards the raw gemstone, i.e., the air nozzles are in the operating position Pl, as shown in Figures 2 to 7 or Figures 8 to 9. The air nozzles 302 are moved to rest position by the control unit when all the cutting planes of the gemstone are cut and "remainder raw gemstone" comprising cut pieces of the raw gemstone needs to be picked by the robotic arm, also referred to as pick and place arm.

In an embodiment, the additional vision system comprising the secondary vision camera 56 facilitates image processing for performing smart match and cutting detection algorithm. In a preferred embodiment, the cutting detection is divided in two phases, i.e., a first phase in which cutting vision is performed by the cutting vision camera 52 and a second phase for secondary verification by the secondary vision camera 56. In other words, the first phase detection is the phase when the cutting detection is confirmed by the cutting vision camera 52 and the second phase detection is the phase when the cutting detection is confirmed by the secondary vision camera 56. The cutting camera always captures images through the focal lens 312, 314.

In the first phase, during the cutting process, when cutting progress crosses 70% (this value is adjustable by the user) and is identified by the control unit upon receiving images from the cutting vision camera 52, a cutting detection is done after every 5% of cutting progress. This detection is done by the cutting vision camera 56. In an embodiment, the cutting process is not paused during this cutting detection. In a preferred embodiment, when the first phase of cutting detection is successfully completed by the cutting vision camera 52, the assembly containing the cutting vision camera 52, focal lens, nozzles 302 etc. is moved up at first and then the cutting fixture 100 containing the gemstone holder or die 108 is moved from the location below the cutting vision camera 52to below the secondary vision camera 56 in Y- direction away from the operator of the cutting apparatus. The cutting fixture 100 shown in Figure 2 is mounted on an X-axis drive and a Y-axis drive to move the cutting fixture in X and Y direction respectively. One of the X-axis drive and the Y-axis drive is responsible for movement of the cutting fixture 100 from the location under the cutting vision camera 52 to the location under the secondary vision camera 56. At this time, the air nozzles 302 are not rotated by the control unit but at the same time move upwards along with the assembly. In the second phase, once the cutting detection is confirmed by the cutting vision camera 52 the cutting process is paused, the cutting fixture 100 carrying the raw gemstone is moved by the control unit to a secondary vision camera 56 and the secondary vision camera 56 "re-checks" the gemstone again. If the cutting detection is also confirmed by the secondary vision camera 56, the current cutting plane is considered as completed.

In a preferred embodiment, the control unit comprises one or more processors. In an embodiment, the processor can be a single processing unit or a number of units, all of which could also include multiple computing units. The processor may be implemented as one or more microprocessors, microcomputers, microcontrollers, digital signal processors, central processing units, state machines, logic circuitries, and/or any devices that manipulate signals based on operational instructions. Among other capabilities, the processor is configured to fetch and execute computer-readable instructions and data stored in a memory. The functions of the processors may be provided through the use of dedicated hardware as well as hardware capable of executing software in association with appropriate software.

In an embodiment, the control unit may further include one or more modules. The module(s) may include routines, programs, objects, components, data structures, etc., which perform particular tasks or implement particular abstract data types. In an embodiment, the processing means may include one or more interfaces having a variety of machine-readable instructions-based interfaces and hardware interfaces that allow the processing means to interact with different entities. The memory may be coupled to the processor and may, among other capabilities, provide data and instructions for generating different requests. In an embodiment, the memory can include any computer-readable medium known in the art including, for example, volatile memory, such as static random-access memory (SRAM) and dynamic random-access memory (DRAM), and/or non-volatile memory, such as read only memory (ROM), erasable programmable ROM, flash memories, hard disks, optical disks, and magnetic tapes. The data serves, amongst other things, as a repository for storing data that may be fetched, processed, received, or generated by one or more of the module(s).

In an embodiment the processor of the control unit is configured to receive the planning data comprising the 3D profile of the raw stone, details of cutting planes and cutting sequence from the planning machine. The processor is also configured to rotate the rotatable members in directions R1 and R2 during smart match process. The processor is also configured to rotate air nozzles from the operating position Pl to the rest position P2. The processor is also configured to trigger the dual camera assembly at the time of cutting. In particular, the processor is configured to trigger the cutting vision camera to detect first phase cutting and trigger a second vision camera for detection of second phase for secondary verification.

While the preferred embodiments of the present invention have been described hereinabove, it should be understood that various changes, adaptations, and modifications may be made therein without departing from the spirit of the invention and the scope of the appended claims. It will be obvious to a person skilled in the art that the present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiments are to be considered in all respects only as illustrative and not restrictive.