Title:
APPARATUS AND METHOD FOR PUNCHING FILM
Document Type and Number:
WIPO Patent Application WO/2020/017684
Kind Code:
A1
Abstract:
The present invention relates to an apparatus and a method for punching a film, the apparatus comprising: a conveyor for supporting and conveying, in one direction, a film which is a punching target punched by a metal embossing die; and a cutter for cutting the film conveyed by the conveyor, wherein the film is cut on the conveyor by the cutter. Therefore, the present invention enables efficient implementation of a series of processes of cutting a punching target, and separating and removing chips scattered when the punching target is punched or cut.
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Inventors:
RYOO KI-TAEK (KR)
KIM MIN-WOOK (KR)
KIM MIN-WOOK (KR)
Application Number:
PCT/KR2018/008628
Publication Date:
January 23, 2020
Filing Date:
July 30, 2018
Export Citation:
Assignee:
FINETECH CO LTD (KR)
FINETOOLS CO LTD (KR)
FINETOOLS CO LTD (KR)
International Classes:
B26D1/04; B26D5/20; B26D7/01; B26D7/18; B26D7/26; B26D9/00; B65H20/06; B65H35/06; B65H39/16
Foreign References:
| KR101577301B1 | 2015-12-15 | |||
| KR101459065B1 | 2014-11-12 | |||
| US20150122098A1 | 2015-05-07 | |||
| KR101176623B1 | 2012-08-23 | |||
| KR101232650B1 | 2013-02-22 |
Attorney, Agent or Firm:
NOH, Kyong-kyu (KR)
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