Technical Field

Embodiments according to the present application are concerned with over the air testing of antenna modules, and particularly with using antenna device for integration in a socket for over the air (OTA) testing of antenna in package modules.

Embodiments according to the invention are related to an antenna device.

Embodiments according to the invention are related to an automated test equipment.

Embodiments according to the invention can be used for far-field and radiating near field over the air testing, as well as for applications like 5G, 6G, WiGig and mmWave Radar.

According to an aspect, embodiments according to the invention can be applied to provide an optimized concept of OTA testing using automated test equipment.

Background of the invention

A multitude of antenna devices is currently known.

Using antenna devices in a socket for over the air (OTA) testing and measurements could result at some problems. In an OTA test and measurement application the requirements are different from an antenna design for an antenna in package (AiP) antenna array. Therefore, simply copying the antenna topology used on an AiP antenna array like a 5G module, won’t bring advantages.

The important requirements to the OTA application are the following:

1. In OTA application the measuring antenna is (often) single one (not an array). Therefore, size of the antenna is not critical.

2. Antenna gain is not critical, since it is used in the radiating near-field and the entire measurement setup is calibrated.

3. It is desirable (or even most important in some cases) to have a large bandwidth to cover all frequencies to be tested. In view of the above, there is a desire to create the antenna design to be used (or useable) in a socket for OTA testing using automated test equipment, which provides a large bandwidth.

Summary of the invention

An embodiment according to the invention creates an antenna device, e.g. OTA socket measurement antenna device, e.g. wideband antenna device, comprising: a printed circuit board (PCB), comprising an opening, e.g. an approximately squared hole, wherein at least two, e.g. orthogonal, e.g. pin, probes are arranged on or in the printed circuit board orthogonally to each other, e.g. to couple with two orthogonal modes of the waveguide; a cavity, e.g. a backshort cavity, e.g. a cavity having a rectangular cross-section or having a squared cross section or having a circular cross section, between a portion of the PCB carrying the probes, e.g. an aperture cutout or a plurality of layers of the PCB carrying the probes; and a waveguide backshort, which may, for example, be formed by a metal base plate or which may, for example, be formed by a layer of a multi-layered PCB. The cavity forms a waveguide (preferably a dual-polarized waveguide), e.g. a rectangular hollow waveguide or a squared hollow waveguide, or a circular hollow waveguide, between the portion of the PCB carrying the probes and the waveguide backshort. The opening in the printed circuit board is arranged in a central area around a central axis of the cavity. The cavity has a depth of a quarter wavelength, e.g. a guided wavelength in the waveguide formed by the cavity, A/4, plus an integer multiple of a half wavelength, wherein the integer may be equal to zero or larger to zero; wherein the wavelength is set at device's center frequency.

It should be noted that technically reasonable tolerances should be considered. For example, acceptable tolerances of the dimensions (e.g. with respect to the depth of the cavity) may be + 1- 1/16 of a wavelength, or may be +/-1/8 of a wavelength.

It should be noted that embodiments create a very wideband device, hence, the wavelength naturally varies when shifting from center frequency to band's edges. In some cases, the variation can exceed the specified 1/16 tolerance on physical length of the backshort.

This embodiment according to the invention is based on the finding that providing the distance between the probes and the backshort plate of a quarter wavelength provides wideband antenna operational frequency range in the antenna device. Moreover, the embodiment is based on the finding that an antenna structure with good properties can be implemented if the antenna comprises the above mentioned waveguide transition with a backshort. It has been found that, for a good or proper operation, it is advantageous that the waveguide backshort has a quarter wavelength.

Therefore, no change of antenna is required to cover the different frequency bands, which minimizes the costs of the implementation.

Moreover, it has been found that the described antenna geometry is well-suited for coupling with one or more antennas of a device under test (DUT) in an automated test equipment. For example, the cavity between the printed circuit board and the backshort may provide a good matching, may also help to efficiently couple to the radiating nearfield of a DUT antenna. Also, it has been found that the cavity improves wideband characteristics of the antenna structure.

According to an embodiment, the probes are disposed in or on the printed circuit board, in an area of the printed circuit board which bounds the cavity between the printed circuit board and the waveguide backshort, e.g. such that the probes couple with electromagnetic modes of cavity. Such disposition of the probes, e.g. inside an aperture cutout, is configured so as the probes excite main orthogonal modes of the waveguide. However, the geometry may also allow a coupling to other modes of the waveguide, like evanescent modes that couple to the radiating nearfield of the DUT antenna.

According to an embodiment, the probes form at least one orthogonal pair of probes, which is configured to excite at least two orthogonal modes of the waveguide, e.g. (TE10 & TE01). This allows for a testing of devices which receive or transmit using different polarizations or using circular polarization.

According to an embodiment, the probes are connected to at least two microstrip lines formed on or in the printed circuit board in an area of the printed circuit board which does not bound the cavity between the printed circuit board and the waveguide backshort, wherein the microstrip lines form feeding networks of the probes, which are, for example, connected to ports via transmission lines. Such a concept allows for a cost-efficient implementation, since, for example, both the probes and the feeding can be realized on a single printed circuit board. An appropriate impedance of the feed lines or even an impedance matching functionality can be implemented by an appropriate geometrical layout (or design) (or impedance) of the feed lines.

According to an embodiment, the feeding networks of the probes are connected to respective differential ports via respective differential line transitions. Differential feeding helps to provide symmetry to antenna circuit, increases decoupling between orthogonal arms and widens operational bandwidth. The feeding networks could, for example, be connected to differential line transitions, e.g. with 100 Ohm differential interfaces. This provides versatility of antenna circuit integration to transceiver chain components on the same board.

According to an embodiment, the feeding networks of one or more of the probes having a first orientation and the feeding networks of one or more of the probes having a second orientation, which is orthogonal to the first orientation, e.g. a first probe of an orthogonal pair and a second probe of an orthogonal pair, are disposed on different, e.g. opposite, layers of the printed circuit board, e.g. with a ground layer in between, such that the ground layer shields the different feeding networks even in a region where the different feeding networks comprise a crossing when seen in a projection onto the PCB plane. Disposition of the feeding networks of the probes on the opposite layers of the PCB provides ease of routing and high isolation. This enables PCB process simplicity because no blind/buried via is required. Moreover, fabrication of multi-layered printed circuit boards is nowadays a standard technology and allows for a costefficient solution with good characteristics. Moreover, the usage of a multi-layered PCB at the same time allows for a quasi-three-dimensional shaping of the probes, using multiple layers.

According to an embodiment, the antenna device comprises four probes, which are arranged in two orthogonal pairs, which are disposed in or on the printed circuit board, in an area of the printed circuit board which bounds the cavity between the printed circuit board and the waveguide backshort, e.g. such that the probes couple with modes of cavity, and which are configured to excite main orthogonal modes, TEw and TE01, of the waveguide. However, the probes may (optionally) also couple to other modes of the waveguide, which may be advantageous under nearfield conditions.

According to an embodiment, the four probes are connected with respective microstrip lines in or on the printed circuit board in an area of the printed circuit board which does not bound the cavity between the printed circuit board and the waveguide backshort, wherein two probes having a first orientation, e.g. two collinear probes, are coupled to a first differential port, e.g. using respective microstrip lines and/or using two differential transmission lines, and wherein two probes having a second orientation, two further collinear probes, are coupled to a second differential port, e.g. using respective microstrip lines and/or using two further differential transmission lines. Differential feeding helps to provide symmetry to antenna circuit, increases decoupling between orthogonal arms and widens operational bandwidth.

According to an embodiment, the printed circuit board comprises at least three layers, preferably four layers. So called “thick probes” (e.g. using multiple layers of the printed circuit board, which may be connected using vias) may thus be created. Consequently, for example, a good (e.g. broadband) coupling between the probes and the fields within the waveguide can be achieved with small effort. For example, it has been found that thickening the probes along the dimension perpendicular to PCB widens operational bandwidth. Also using multiple PCB layers helps to improve matching and broadband characteristics.

According to an embodiment, the printed circuit board is arranged, e.g. attached, on a surface of, e.g. on top of, a metal base plate, and the cavity is formed in the metal base plate, e.g. in an upper part of the metal base plate, wherein e.g. the metal base plate also forms the waveguide backshort. A decreased size of the antenna device is thus provided. Also, fabrication is relatively simple, wherein milling technology may, for example, be used.

According to an embodiment, the printed circuit board is a, e.g. thick, multi-layer printed circuit board, e.g. comprising more than 4 layers; e.g. comprising 8 or more layers; and the waveguide backshort is implemented using a layer, e.g. a metal layer, of the printed circuit board, as a PCB layer; and/or boundaries, e.g. sidewall boundaries, of the cavity are implemented using vias through the multi-layer printed circuit board, e.g. using plated through via holes which may, for example, extend through a plurality of layers of the PCB. A through hole inside the aperture cutout could be provided for increasing antenna bandwidth. Such an approach allows for a cost-efficient fabrication of the antenna structure using PCB fabrication technology. Even though the characteristic of the cavity (e.g. of the cavity walls) are not optimal using such an approach, it has been found that the characteristics of such a structure are still sufficiently good for many testing requirements. According to an embodiment, the cavity has a width of a half wavelength, A/2. It has been found that such dimensions result in good characteristics of the antenna structure.

According to an embodiment, the probes have a length that is equal to the depth of the cavity within a tolerance of 1/16 of the wavelength. It has been recognized that such dimensions provide particularly good antenna characteristics.

According to an embodiment, the probes pass through several layers of the PCB connected through one or more probe vias. It has been recognized that this increases broadband performance of the antenna structure while being implementable at reasonable cost.

According to an embodiment, the antenna device further comprises an upper metal plate, wherein an additional waveguide portion is formed in the upper metal plate, such that the additional waveguide portion is an extension of the waveguide formed by the cavity. The additional waveguide portion increases an antenna bandwidth.

According to an embodiment, the printed circuit board is arranged between the metal base plate and the upper metal plate. Two-portions waveguide is thus provided. Moreover, a feed structure can be easily fabricated using such a layout (or design), e.g. by milling tranches in the metal base plate or in the upper metal plate, e.g. along feed traces on the printed circuit board.

According to an embodiment, the differential transmission lines comprise shielding thereon. An improved isolation is provided. Such shielding can, for example, be provided using the metal base plate and/or the upper metal plate.

According to an embodiment, the antenna device comprises one or more external connections, e.g. blind mating waveguide connections, wherein a first external connection, e.g. a first waveguide connection, is coupled with one or more of the probes having a first orientation, and/or wherein a second external connection, e.g. a second waveguide connection, is coupled with one or more probes having a second orientation, which may be orthogonal to the first orientation. An improved routing and isolation is provided then. Using such connections, the antenna device can, for example, be coupled with one or more signal sources and/or one or more signal receivers of an automated test equipment. Thus, the antenna device may, for example, be coupled to a test head of an automated test equipment using the one or more external connectors.

According to an embodiment, the one or more external connections are waveguide connections. It has been recognized that waveguide connections comprise a particularly small wear-out and are therefore well-suited for volume test in which the antenna device is connected with and disconnected from an automated test equipment very often.

According to an embodiment, the one or more external connections are blind mating connections, e.g. blind-mating waveguide connections. The blind-mating waveguide connections could be used, for example, for connecting the measurement antenna millimeter wave signals to the measurement instrumentation of the automated test equipment. The blind mating capabilities of the external connectors allow for a rapid connection and disconnection, e.g. controlled by a robot handler. Thus, a high test throughput is enabled.

According to an embodiment, the one or more external connections are aligned towards a direction, e.g. to make contact in a direction, which is identical to a main radiation direction of the antenna device. Accordingly, the antenna device can be placed “on top” of a device under test, which may, for example, be placed in a test socket arranged on a DUT board, and route back the signals in a direction towards the DUT board (e.g. in a direction towards an opening in the DUT port, in which a high frequency connection is located).

According to an embodiment, the antenna device comprises an electromagnetically permeable, e.g. electromagnetically transparent, cover, which covers the waveguide. Thus, the waveguide can be protected, and the cover may also serve to push the device under test into its desired position (e.g. into a test socket). According to an embodiment, the cover is configured to push a device under test into a device under test location, e.g. into a test socket, while allowing for a transit of electromagnetic radiation from the waveguide to the device under test or vice versa. Thus, the antenna device can (at least partially) take over the functionality of a pusher, which helps to reduce costs and accelerate an exchange of the device under test.

An embodiment according to the invention creates an automated test equipment (ATE), the automated test equipment comprises an antenna device according to one of the preceding claims, wherein the automated test equipment is configured to test a device under test, e.g. a wireless device under test; e.g. an antenna-in package device under test, using the antenna device.

The automated test equipment according to this embodiment is based on the same considerations as an antenna device described above. Moreover, this disclosed embodiment may optionally be supplemented by any other features, functionalities and details disclosed herein in connection with the antenna device, both individually and taken in combination.

An embodiment according to the invention creates an automated test equipment, wherein the automated test equipment comprises a device under test socket and one or more, e.g. blind mating, high frequency connectors, e.g. waveguide connectors, e.g. for establishing a high frequency connection with the antenna device, wherein the one or more high frequency connectors are arranged beside the test socket.

The automated test equipment according to this embodiment is based on the same considerations as an antenna device described above. Moreover, this disclosed embodiment may optionally be supplemented by any other features, functionalities and details disclosed herein in connection with the antenna device, both individually and taken in combination.

According to an embodiment, the test socket and the one or more high frequency connectors are arranged such that one or more external connections of the antenna device mate with the one or more high frequency connectors and such that a cover of the antenna device pushes the device under test into the device under test socket when the one or more external connections of the antenna device mate with the one or more high frequency connectors.

The antenna device and the automated test equipment may optionally be supplemented by any of the features, functionalities and details disclosed herein (in the entire document), both individually and taken in combination.

Brief description of the Figures

Preferred embodiments of the present application are set out below taking reference to the figures among which

Fig 1 shows an antenna device in accordance with an embodiment;

Fig 2A shows an antenna device in accordance with an embodiment in the disassembled state;

Fig 2B shows an antenna device of Fig 2A in accordance with an embodiment in the assembled state;

Fig 2C shows a sectional view of an antenna device of Fig 2A in accordance with an embodiment in the assembled state;

Fig 3A shows an antenna device in accordance with an embodiment in the assembled state;

Fig 3B shows an antenna device of Fig 3A in accordance with an embodiment in the assembled state without the top metal plate;

Fig 3C schematically shows an antenna device of Fig 2A in accordance with an embodiment;

Fig 4A shows an antenna device in accordance with an embodiment;

Fig 4B shows a back view of the antenna device of Fig 4A in accordance with an embodiment;

Fig 4C shows an increased sectional view of the antenna device of Fig 4A in accordance with an embodiment; Fig 4D schematically shows an increased sectional view of the antenna device of Fig 4A in accordance with an embodiment;

Fig 5A shows an antenna device in accordance with an embodiment;

Fig 5B shows the antenna device of Fig 5A in the housing in accordance with an embodiment;

Fig 5C shows the antenna device of Fig 5B in the disassembled state in accordance with an embodiment;

Fig 5D shows the antenna device of Fig 5A in the operational state in accordance with an embodiment;

Fig 6A shows antenna simulation results of an antenna device in accordance with an embodiment;

Fig 6B shows antenna simulation results of an antenna device in accordance with an embodiment;

Fig 7A shows an automated test equipment in accordance with an embodiment;

Fig 7B shows an automated test equipment in accordance with an embodiment.

Detailed description

Fig. 1 shows an antenna device 100 in accordance with an embodiment. The antenna device 00 comprises a printed circuit board (PCB) 110 comprising an opening 111 and at least two probes 112 arranged in the printed circuit board orthogonally to each other. The opening 111 is, for example, an approximately squared hole. Although Fig. 1 shows two orthogonal probes 112, in the embodiment, four probes forming two orthogonal pairs could be arranged in the printed circuit board 110.

The antenna device 100 comprises a backshort 120, which may, for example, be formed by a metal base plate or which may, for example, be formed by a layer of a multi-layered PCB.

The antenna device 100 comprises a cavity 130 between a portion of the PCB 110 carrying the probes 112, e.g. an aperture cutout or a plurality of layers of the PCB 110 carrying the probes 112, and the backshort 120. The cavity 130 may have, for example, a rectangular cross-section or a squared cross section. The cavity 130 forms a waveguide between the portion of the PCB 110 carrying the probes 112 and the backshort 120, e.g. the waveguide backshort 120. The opening 111 in the printed circuit board 110 is arranged in a central area around a central axis of the cavity 130. The cavity 130 has a depth of a quarter wavelength, e.g. a guided wavelength in the waveguide formed by the cavity, A/4, plus an integer multiple of a half wavelength, wherein the integer may be equal to zero or larger to zero; wherein the wavelength is set at device's center frequency.

The probes 112 are disposed on (or in) the printed circuit board 110, in an area 113 of the printed circuit board 110 which bounds the cavity 130 such that the probes 112 couple with modes of cavity 130.

The probes 112 form an orthogonal pair of probes 112, which is configured to excite at least two orthogonal modes of the waveguide.

The probes 112 are connected to at least two microstrip lines 114 formed on or in the printed circuit board 110 in an area 115 of the printed circuit board 110, which does not bound the cavity 130. The microstrip lines 114 form feeding networks of the probes, which are, for example, connected to ports via transmission lines. In an embodiment, the feeding networks of the probes 112 could be, for example, connected to respective differential ports via respective differential line transitions.

The feeding networks of one or more of the probes 112i having a first orientation and the feeding networks of one or more of the probes 1122 having a second orientation, which is orthogonal to the first orientation are disposed on different, e.g. opposite, layers of the printed circuit board 110, e.g. with a ground layer in between, such that the ground layer shields the different feeding networks.

However, it should be noted that the antenna device 100 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

Figs. 2A-2C show an antenna device 200 in accordance with an embodiment.

Fig. 2A shows the antenna device 200 in the disassembled state. As shown in Fig. 2A, the antenna device 200 comprises a printed circuit board (PCB) 210 comprising an opening 211 and four probes 212, which are arranged in two orthogonal pairs. The opening 211 is an approximately squared hole. The opening 211 is a through hole for increasing antenna bandwidth. The antenna device 200 comprises a backshort 220. The backshort 220 is formed by a metal base plate. The printed circuit board 210 is arranged, e.g. attached, on top of, the metal base plate, and a cavity 230 is formed in an upper part of the metal base plate, wherein the metal base plate also forms the waveguide backshort 220. The cavity 230 has approximately the form corresponding to the opening 211 .

The antenna device 200 thus comprises the cavity 230 between a portion of the PCB 210 carrying the probes 212, namely an aperture cutout, and the backshort 220. The cavity 230 is shown having a squared cross section. However, the cavity 230 may, for example, have a rectangular cross section, or a circle cross section, or an oval cross section. The cavity 230 forms a waveguide between the portion of the PCB 210 carrying the probes 212 and the waveguide backshort 220. The opening 211 in the printed circuit board 210 is arranged in a central area around a central axis of the cavity 230. The cavity 230 has a depth of a quarter wavelength, e.g. a guided wavelength in the waveguide formed by the cavity, A/4, plus an integer multiple of a half wavelength, wherein the integer may be equal to zero or larger to zero; wherein the wavelength is set at device's center frequency.

The probes 212 are arranged in two orthogonal pairs, which are disposed on the printed circuit board 210, in an area 213 of the printed circuit board 210, which bounds the cavity 230 between the printed circuit board 210 and the waveguide backshort 220, such that the probes couple with electromagnetic modes of cavity, and which are configured to excite main orthogonal modes, TE and TE01, of the waveguide.

The four probes 212 are connected with respective microstrip lines 214 on the printed circuit board 210 in an area 215 of the printed circuit board 210, which does not bound the cavity 230. Two probes 212i have a first orientation and represent two collinear probes. The two probes 212i are coupled to a first differential port 217i using respective microstrip lines 214i and using differential line 2161. Two probes 2122 have a second orientation and represent two further collinear probes. The two probes 2122 are coupled to a second differential port 2172 using respective microstrip lines 214 ₂ and using further differential line 216 ₂ . The first orientation is orthogonal to the second orientation. Differential feeding provides symmetry to antenna circuit, increases decoupling between orthogonal arms and widens operational bandwidth. The differential transmission lines may, for example, comprise shielding thereon.

The metal base plate 220 comprises parts configured to accommodate the microstrip lines 2142 and differential line 2162, e.g. channels 229 made in an upper part of the metal base plate 220 corresponding to the microstrip lines 214 ₂ and differential transmission lines 2162. The metal base plate 220 also comprises a cutout, e.g. an opened up cutout, which corresponds to the second differential port 2172. The feeding networks of the two probes 212i having a first orientation and the feeding networks of the two probes 2122 having a second orientation, which is orthogonal to the first orientation, are disposed on opposite layers of the printed circuit board 210, e.g. with a ground layer in between, such that the ground layer shields the different feeding networks. Disposition of the feeding networks on the opposite layers of the PCB 210 provides ease of routing and high isolation. This enables PCB process simplicity, since no blind or buried via is required. The feeding networks are connected to differential lines 216 with 100 Ohm differential interfaces. This provides versatility of antenna circuit integration to transceiver chain components on the same board.

The cavity 230 has a width of a half wavelength, A/2. The probes 212 have an electrical length that is preferably (at least approximately) equal to the depth of the cavity, e.g. within a tolerance of 1/16 of the wavelength. For example, the length of the probes may depend on the particular dielectric of PCB. For example, if Alumina substrate is used, the probes are shorter (e.g. shorter than a depth of the cavity). However, for example, the electrical length, i.e. in wavelengths, can be considered approximately the same for different materials.

The antenna device 200 further comprises an upper metal plate 240, wherein an additional waveguide portion 250 is formed in the upper metal plate 240, such that the additional waveguide portion 250 is an extension of the waveguide formed by the cavity 230.

The upper metal plate may comprise, e.g. channels made in a bottom part of the upper metal plate 240 corresponding to the microstrip lines 214i and differential line 2161. The upper metal plate 240 may also comprise a cutout, e.g. an opened down cutout, e.g. a cutout 241 shown in Fig. 2B, which corresponds to the first differential port 217i.

The printed circuit board 210 is arranged between the metal base plate 220 and the upper metal plate 240. As will be shown in the following Figures, the printed circuit board 210 is pressed between the metal base plate 220 and the upper metal plate 240.

The antenna device may comprise, for example, one or more external connections, e.g. blind mating waveguide connections, wherein a first external connection, e.g. a first waveguide connection, is coupled with one or more of the probes having a first orientation, and/or wherein a second external connection, e.g. a second waveguide connection, is coupled with one or more probes having a second orientation, which may be orthogonal to the first orientation.

The one or more external connections may be, for example, waveguide connections.

The one or more external connections may be, for example, blind mating connections, e.g. blind-mating waveguide connections. The one or more external connections may be aligned, for example, towards a direction, e.g. to make contact in a direction, which is identical to a main radiation direction of the antenna device 200.

Fig. 2B shows an antenna device of Fig 2A in accordance with an embodiment in the assembled state. As shown in Fig. 2B, the PCB 210 is arranged between the metal base plate 220 and the upper metal plate 240. The PCB 210 is pressed between the metal base plate 220 and the upper metal plate 240.

The cavity 230 and correspondingly the waveguide is not seen in Fig. 2B since the cavity 230 is arranged in the top part of the waveguide backshort 220 and closed by the PCB 210 and the top plate 240. The additional waveguide portion 250 is shown as formed in the upper metal plate 240.

Cutouts 241 are formed in the bottom part of the upper metal plate 240, one on each of the two adjusting lateral sides of the upper metal plate 240. The cutouts 241 are arranged above the respective microstrip lines 214i arranged on the upper part of the printed circuit board 210 in an area 215 of the printed circuit board 210, which does not bound the cavity 230. The cutouts have approximately rectangular form.

Fig 2C shows a sectional view of the antenna device 200 in accordance with an embodiment in the assembled state.

As shown in Fig. 2C, the PCB 210 comprises multiple layers. The printed circuit board 210 may comprise at least three layers, for example, preferably four layers. The probes 212 utilize, e.g. extend or pass through, several PCB layers connected through probe vias 218.

The cavity 230 is shown in Fig. 2C, as arranged in the top part of the waveguide backshort 220 between the waveguide backshort 220 and the PCB 210. An additional cutout 221 is arranged in the upper part of the waveguide backshort 220. The additional cutout 221 may, for example, have a depth at least twice smaller (or by a factor of 2 smaller) than the depth of the cavity 230. However, it should be noted that there is no strict requirement on the cutout depth. For example, it should preferably (but not necessarily) not be too small to have an impact on transmission line impedance. The additional cutout 221 is formed to accommodate the respective microstrip lines 2142 and the two further differential transmission lines 216 ₂ , which couple the probes 212 ₂ to a second differential port 217 ₂ .

The cavity 230 may, for example, have a squared cross section. The cavity 230 forms a waveguide between the portion of the PCB 210 carrying the probes 212 and the waveguide backshort 220. The opening 211 in the printed circuit board 210 is arranged in a central area around a central axis of the cavity 230. The cavity 230 has a depth of a quarter wavelength, e.g. a guided wavelength in the waveguide formed by the cavity, A/4, plus an integer multiple of a half wavelength, wherein the integer may be equal to zero or larger to zero; wherein the wavelength is set at device's center frequency.

However, it should be noted that the antenna device 200 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

Figs. 3A-3C show an antenna device 300 in accordance with an embodiment.

Fig. 3A shows the antenna device 300 in the assembled state. As shown in Fig. 3A, the antenna device 300 comprises a printed circuit board (PCB) 310 comprising an opening 311 and four probes 312, which are arranged in two orthogonal pairs. The opening 311 is shown as an approximately squared hole. However, the opening 311 may also have, for example, approximately rectangular hole, or approximately oval hole, or approximately circle hole. Angles of a square are shown rounded. The opening 311 is a through hole for increasing antenna bandwidth.

The antenna device 300 comprises a backshort 320. The backshort 320 is formed by a metal base plate. The printed circuit board 310, which may correspond to the printed circuit board 210, is arranged, e.g. attached, on top of, the metal base plate, and a cavity (not shown) is formed in an upper part of the metal base plate, wherein the metal base plate also forms the waveguide backshort 320.

The antenna device 300 further comprises an upper metal plate 340, wherein an additional waveguide portion 350 is formed in the upper metal plate 340, such that the additional waveguide portion 350 is an extension of the waveguide formed by the cavity (not shown).

The printed circuit board 310 is arranged, e.g. pressed, between the metal base plate 320 and the upper metal plate 340.

The four probes 312 are connected with respective microstrip lines (not seen under the upper metal plate 340) on the printed circuit board 310 in an area 315 of the printed circuit board 310, which does not bound the cavity. Two probes 312i have a first orientation and represent two collinear probes. The two probes 312i are coupled to a first port (e.g. in the form of a coaxial connector 360i) using a microstrip line 317i (which may partially extend under the upper metal plate 340) , using differential line 3161 (not seen under the upper metal plate 340) and using further microstrip lines 314i, wherein there may be a balun 319 (not shown in Fig. 3A) in between the microstrip line 317i and the differential lines 3161. Two probes 3122 have a second orientation and represent two further collinear probes. The two probes 3122 are coupled to a second port (e.g. in the form of a coaxial connector 36O2) using a microstrip line, using (e.g. two) differential lines (not shown) and using respective microstrip lines (not shown), wherein there may be a balun (not shown) in between the microstrip line and the differential lines. The first orientation is orthogonal to the second orientation. Differential feeding provides symmetry to antenna circuit, increases decoupling between orthogonal arm and widens operational bandwidth. The differential transmission lines may, for example, comprise shielding thereon.

The PCB 310 is shown extending beyond the sizes of the metal base plate 320 and the upper metal plate 340. The metal plate 320 and PCB 310 can vary in sizes, with arbitrary ratio between them. It depends on the mechanics, not device's operation.

Two coaxial connectors 360 are mounted on the PCB 310. A first coaxial connector 360i is arranged to connect a first microstrip line 317i to a measurement instrument. A second coaxial connector 3602 is arranged to connect a second microstrip line (not shown) to a measurement instrument.

Fig. 3B shows the antenna device 300 in the assembled state without the top metal plate 340. As shown in Fig. 3B, the printed circuit board (PCB) 310 comprises the opening 311 and the four probes 312, which are arranged in two orthogonal pairs.

The four probes 312 are connected with respective microstrip lines 314 on the printed circuit board 310 in an area 315 of the printed circuit board 310, which does not bound the cavity 330. Two probes 312i have a first orientation and represent two collinear probes. The two probes 312i are coupled to a first differential port 3181 using respective microstrip lines 314i and using differential line 3161. Two probes 3122 have a second orientation and represent two further collinear probes. The two probes 3122 are coupled to a second differential port (not seen) using respective microstrip lines (not shown) and using further differential line (not shown). The first orientation is orthogonal to the second orientation. Differential feeding provides symmetry to antenna circuit, increases decoupling between orthogonal arm and widens operational bandwidth. The differential transmission lines may, for example, comprise shielding thereon.

The first differential port 3181 is connected to a microstrip line 317i via a balun 319. The microstrip line 317i is connected to the first coaxial connector 360i, thus connecting the first differential port 3181 to a corresponding measurement instrument. The second coaxial connector 3602 is arranged upside down in relation to the first coaxial connector 360i in order to connect the second differential port located on the bottom side of the PCB 310 to a corresponding measurement instrument.

The first and second coaxial connectors 360 are attached, e.g. fixed, to the adjusting sides of the PCB 310 by the screws 362. The first and second coaxial connectors 360 are attached upside down to each other, e.g. placed in the planes, 180 degrees rotated to each other.

A plurality of plated through via holes 390 forms sidewalls of the backshort 320 and correspondingly of the cavity 330.

The cavity sidewalls or waveguide sidewalls , e.g. sidewall boundaries, of the cavity 330 are implemented using vias 390 through the multi-layer printed circuit board 310, e.g. using plated through via holes which may, for example, extend through a plurality of layers of the PCB 310.

A plurality of, e.g. plated, through via holes 391 forms shielding, e.g. route, of the respective microstrip lines.

Fig. 3C schematically shows the antenna device 300. Fig. 3C shows only the PCB 310 (top view) of the antenna device 300 and the coaxial connectors 360.

As shown in Fig. 3C, the antenna device 300 comprises a printed circuit board (PCB) 310 comprising an opening 311 and four probes 312, which are arranged in two orthogonal pairs.

The probes 312 are arranged in two orthogonal pairs, which are disposed on the printed circuit board 310, in an area 313 of the printed circuit board 310, which bounds the cavity 330 between the printed circuit board 310 and the waveguide backshort 320, such that the probes couple with electromagnetic modes of cavity.

The four probes 312 are connected with respective microstrip lines 314 on the printed circuit board 310 in an area 315 of the printed circuit board 310, which does not bound the cavity 330. The two probes 312i are coupled to a first differential port 3181 using respective microstrip lines 314i and using differential line 3161. Two probes 312a have a second orientation and represent two further collinear probes.

It should be noted that the differential line portion 316 (e.g. comprising a differential line 3161 having two conductors, wherein a first one of the two conductors is coupled with a first microstrip line 314i and wherein a second one of the two conductors is coupled with a second microstrip line 314i ) is bounded by (e.g. in between) a balun 319 and a joint point of a pair of microstrip feeding lines 314i .

The feeding networks of the two probes 312i having a first orientation and the feeding networks of the two probes 3122 having a second orientation, which is orthogonal to the first orientation, are disposed on opposite layers of the printed circuit board 310, e.g. with a ground layer in between, such that the ground layer shields the different feeding networks. Disposition of the feeding networks on the opposite layers of the PCB 310 provides ease of routing and high isolation. This enables PCB process simplicity, since no blind or buried via is required.

A plurality of plated through via holes 390 forms sidewalls of the backshort 320 and correspondingly of the cavity 330.

The boundaries, e.g. sidewall boundaries, of the cavity 330 are implemented using vias 390 through the multi-layer printed circuit board 310, e.g. using plated through via holes which may, for example, extend through a plurality of layers of the PCB 310.

A plurality of, e.g. plated, through via holes 391 forms shielding of the respective microstrip lines.

However, it should be noted that the antenna device 300 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

Figs. 4A-4D show an antenna device 400 in accordance with an embodiment.

As shown in Fig. 4A, the antenna device 400 comprises a printed circuit board (PCB) 410 comprising an opening 411 and four probes 412, which are arranged in two orthogonal pairs. The opening 411 is an approximately squared hole. The opening 411 is a through hole for increasing antenna bandwidth.

The antenna device 400 comprises a backshort 420 (not shown in Fig. 4A).

The printed circuit board 410 is a, e.g. thick, multi-layer printed circuit board. The PCB 410 comprises more than 4 layers, or preferably comprises 8 or more layers. The waveguide backshort 420 is implemented using a layer, e.g. a metal layer, of the printed circuit board, as a PCB layer. A bottom PCB layer serves as a metal backshort 420.

The PCB 410 has a thickness defined as

.where s _r is the dielectric permittivity of the PCB substrate (dielectric) material

The antenna device 400 thus comprises the cavity 430 between a portion of the PCB 410 carrying the probes 412, namely an aperture cutout, and the backshort 420. The cavity 430 may, for example, have a squared cross section. The cavity 430 forms a waveguide between the portion of the PCB 410 carrying the probes 412 and the waveguide backshort 420. The opening 411 in the printed circuit board 410 is arranged in a central area around a central axis of the cavity 430. The cavity 430 has a depth of a quarter wavelength in PCB substrate material, e.g. a guided wavelength in the waveguide formed by the cavity, A/4, divided by ^s _r plus an integer multiple of a half wavelength, wherein the integer may be equal to zero or larger to zero; wherein the wavelength is set at device's center frequency.

The boundaries, e.g. sidewall boundaries, of the cavity 430 are implemented using vias 490 through the multi-layer printed circuit board 410, e.g. using plated through via holes which may, for example, extend through a plurality of layers of the PCB 410.

As could be further seen in Figs. 4A to 4D, plurality of plated through via holes 490 forms sidewalls of the backshort 420 and correspondingly of the cavity 430.

The boundaries, e.g. sidewall boundaries, of the cavity 430 are implemented using vias 490 through the multi-layer printed circuit board 410, e.g. using plated through via holes which may, for example, extend through a plurality of layers of the PCB 410.

A plurality of, e.g. plated, through via holes 491 forms shielding of the respective microstrip lines, as could be seen in Figs. 4A, 4C and 4D.

As shown in Figs. 4A, 4C and 4D, the probes 412 are arranged in two orthogonal pairs, which are disposed on the printed circuit board 410, in an area 413 of the printed circuit board 410, which bounds the cavity 430 between the printed circuit board 410 and the waveguide backshort 420, such that the probes couple with modes of cavity, and which are configured to excite main orthogonal modes, TEw and TE01, of the waveguide.

The four probes 412 are connected with respective microstrip lines 414 on the printed circuit board 410 in an area 415 of the printed circuit board 410, which does not bound the cavity 430. Two probes 412i have a first orientation and represent two collinear probes. The two probes 412i are coupled to a first differential port 4181 using respective microstrip lines 414i and using differential line 4161. Two probes 4122 have a second orientation and represent two further collinear probes. The two probes 4122 are coupled to a second differential port (not shown) using respective microstrip lines (not shown) and using further differential line (not shown). The first orientation is orthogonal to the second orientation. Differential feeding provides symmetry to antenna circuit, increases decoupling between orthogonal arm and widens operational bandwidth. The differential transmission lines may, for example, comprise shielding thereon.

As shown in Fig. 4C, the probes 412 utilize, e.g. extend or pass through, several PCB layers of the thick PCB connected through probe vias 419. The probes 412 connect upper layer of the PCB layer. The probes 412 utilize, for example, at least three PCB layers, e.g. at least three upper PCB layers are connected through the probe vias 419. For example, not all PCB layers are utilized by the probes 412. In some implementations, the probes 412 may, for example, utilize less than a half of the PCB layers. However, it should be noted that a desired (or required) number of layers in probes depends, for example, on the required antenna bandwidth. Probes utilize, at least, one or two metal layers. The probes do not necessarily utilize the topside layers - they (e.g. the utilized layers) can also hide inside internal layers

It could be also seen in Fig. 4D that the probes 412 are formed as multiple-layer probes.

However, it should be noted that the antenna device 400 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

Figs. 5A-5D show an antenna device 500 and/or its parts in accordance with an embodiment.

Fig. 5A shows a printed circuit board (PCB) 510 comprising an opening 511 and four probes 512, which are arranged in two orthogonal pairs. The opening 511 is an approximately squared hole. The opening 511 is a through hole for increasing antenna bandwidth. Although the opening 511 is shown as an approximately square hole, the opening 511 may be also, for example, an approximately rectangular hole, or an approximately circle hole, or an approximately oval hole, or the opening may comprise a crucial shape or an X-shape. However, other shapes of the hole could also be used.

The four probes 512 are connected with respective microstrip lines 514 on the printed circuit board 510 in an area 515 of the printed circuit board 510, which does not bound the cavity 530. Two probes 512i have a first orientation and represent two collinear probes. The two probes 512i are coupled to a first (e.g. differential) waveguide transition 594i using respective microstrip lines 514i and using differential lines 5161. Two probes 5122 have a second orientation and represent two further collinear probes. The two probes 5122 are coupled to a second (e.g. differential) waveguide transition (not seen) using respective microstrip lines (not shown) and using further differential line (not shown). The first orientation is orthogonal to the second orientation. Differential feeding provides symmetry to antenna circuit, increases decoupling between orthogonal arm and widens operational bandwidth. The differential transition lines may, for example, comprise shielding thereon.

Fig. 5B shows the antenna device 500 in the assembled state, e.g. in a metal housing 560, e.g. in a ready to use state.

A backshort of the antenna 500 is formed, for example, by a metal base plate (e.g. by plate 570 or by a plate 580) or by a layer (e.g. a bottom layer) of the printed circuit board. The printed circuit board 510 is arranged, e.g. attached, on top of, the metal base plate 570, and a cavity (not shown) is formed, for example, in an upper part of the metal base plate 570, wherein, for example, the metal base plate 570 also forms the waveguide backshort 520.

Separate parts of the metal housing are shown in Fig. 5C. An upper layer 568 of the metal base plate is shown comprising mount holes 528 for screws configured to fix parts of the metal housing together.

An additional waveguide portion is formed in the upper metal plate 568, such that the additional waveguide portion is an extension of the waveguide formed by the cavity (not shown).

The printed circuit board 510 is arranged, e.g. pressed, between the upper metal plate 568 and the middle metal plate 570 in an assembled state of the antenna 500.

In addition to the upper metal plate 568, the metal housing further comprises two metal layers 570 (e.g. designated as a middle metal layer) and 580 (e.g. designated as a lower metal layer), both having (respective) central parts 571 , 581 and two pairs of (respective) peripherical parts 572, 573, 582, 583. For example, the central parts 571 , 581 of the two metal layers 570, 580 correspondingly have the form approximating to the form of the PCB 510 (e.g. an approximately rectangular or quadratic form) and the upper metal plate 568. For example, the first peripherical parts 572, 582 of two metal layers 570, 580 correspondingly extend from two opposite sides of the central parts 571 , 581 at an angle and form metal plates. For example, the second peripherical parts 573, 583 of the two metal layers 570, 580 correspondingly extend at an angle from the first peripherical parts 572, 582 and form metal plates. The second peripherical parts 573, 583 are, for example, arranged parallel to the central parts 571 , 581 , e.g. sides of the second peripherical parts 573, 583 are parallel to corresponding sides of the central parts 571 , 581. One metal layer 570 comprises mount holes 574 for mounting the upper metal plate 568 to the middle metal plate 570 and to the lower metal layer 580. The metal layers may, for example, also comprise alignment means, like alignment pins or alignment holes. Another (lower) metal layer 580 comprises two waveguide structures 575,576 for the first and second polarizations. For example, both metal layers 570, 580 comprise mount holes 578, 588 for fixing the antenna 500 in the metal housing and mount holes for attaching the antenna 500 in the metal housing 560 to the corresponding testing stand or test equipment.

Fig. 5D shows the antenna device 500 in the assembled state, e.g. in the metal housing 560, and attached at a testing stand 580a. The testing stand has an upper part 583a and a below part 584a. The below part 584a stands on a stable base 585a and is attached to the stable base 585a with screws 586a. The parts of the metal housing 560 are, for example, fixed on the testing stand 580a with metal fixators 581a. The metal fixators 581a have generally an n- form. The metal fixators 581a hold the second peripherical parts 573, 583 (or the entire antenna device 500) in a hollow cutout 582a of the testing stand 580a. The hollow cutout 582a has the form corresponding to the metal housing 560. The metal fixators 581a are attached to the upper part 583a of the testing stand 580a with screws 587a, e.g. each metal fixator 581a is attached with four screws 587a.

First and second coaxial connectors 590a, 591a are attached to waveguide transitions 592a, 593a, which establish an electromagnetic coupling with the waveguide structures 575,576. Thus, the coaxial connectors are effectively coupled with the antenna by the waveguide transitions 592a, 593a, the waveguide structures 575, 576 and transmission line traces (e.g. a waveguide coupling structure 594i, differential lines 5161 and microstrip lines 514i) on the printed circuit board 510. Accordingly, a first coaxial connector 590a is associated with a first polarization, and a second coaxial connector 591a is associated with a second polarization.

However, it should be noted that the antenna device 500 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

Figs. 6A and 6B show antenna simulation results of an antenna device in accordance with an embodiment. Any of the antenna devices 100, 200, 300, 400 and 500, shown in Figs. 1 , 2, 3, 4, and 5 correspondingly, could show similar performance to the results represented in Figs. 6A and 6B. Fig. 6A shows an antenna 3D radiation pattern, as well as antenna radiation patterns in planes E (an electric field plane) and H (a magnetic field plane), at frequencies Fi=24.25GHz, F ₂ =29.5GHZ, F ₃ =37GHZ, F ₄ =40GHZ.

Fig. 6B shows graphics of an antenna boresight gain and an antenna reflection coefficient dependencies over frequency.

As could be seen in Figs. 6A and 6B, an electrical performance of the antenna device in accordance with an embodiment could be characterized by:

1 . Operational frequency band of 22-43 GHz (65%) considering 10 dB RL;

2. Insertion loss in antenna circuit of the range between 0.75 and 1.35 dB over the frequency band (Megtron6-based board);

3. Antenna gain of the range between 6 and 9.5 d Bi over the band;

4. Port-to-port leakage of less than -80 dB over the band; and

5. Cross-polarized component discrimination in far-field of higher than 55 dB over the band.

At the same time the mechanical performance of the antenna device in accordance with the embodiment could be characterized by:

1 . Antenna circuit occupying only 2><2Ao area in PCB, where Ao is calculated at the center frequency of 32.5 GHz;

2. Antenna PCB utilizing at least 3 layers, where its processing does not require blind or buried vias.

Figs. 7A and 7B show an automated test equipment with an antenna device 700.

The automated test equipment comprises the antenna device 700. The automated test equipment is configured to test a device 792 under test, e.g. a wireless device under test; e.g. an antenna-in package device under test, using the antenna device 700.

The automated test equipment carries the device 792 under test in an electrical socket and comprises blind mating connectors 793. Two blind mating connectors 793 are shown in Fig. 7A. However, the automated test equipment may comprise one or more blind mating connectors 793. The blind mating connectors 793 could be, e.g. high frequency connectors, e.g. waveguide connectors, as those shown in Fig. 7A. The blind mating connectors 793 are configured, for example, to establish a high frequency connection with the antenna device 700.

The connectors 793 are arranged beside a test socket.

The antenna device 700, e.g. OTA measurement antenna, in a metal housing is fixed in a socket lid 790. A pusher 791 is attached to the antenna device 700. The pusher 791 is made from a radio transparent material. The pusher 791 is installed to push the device 792 under test into the electrical socket. The pusher 791 may be also configured as a cover of the antenna device 700 in an embodiment.

Upon installation of the socket lid 790 on the automated test equipment, first and second (preferably blind-mating) waveguide connectors 794 interconnect with the blind mating waveguides 793. The blind mating waveguides 793 connect the measurement antenna millimeter wave signals to ATE measurement instrumentation.

The antenna device 700 comprises two external connections 794, which are preferably waveguide connections. Although two external connections 794 are shown in Fig. 7A, the antenna device 700 may comprise one or more external connections 794.

The test socket 792 and the connectors 793 are arranged such that external connections 794 of the antenna device 700 mate with the connectors 793 and such that the pusher 791 of the antenna device 700 pushes the device 792 under test into the device under test socket when the connections 794 of the antenna device 700 mate with the connectors 793.

Fig. 7B shows the antenna device 700 fixed on the automated test equipment.

However, it should be noted that the automated test equipment 700 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

Further embodiments and Aspects

In the following, further aspects and embodiments according to the invention will be described, which can be used individually or in combination with any other embodiments disclosed herein.

Moreover, the embodiments disclosed in this section may optionally be supplemented by any other features, functionalities and details disclosed herein, both individually and taken in combination.

In the following, an antenna layout (or design) to be used for integration in a socket for over the air (OTA) testing of antenna in package (AiP) modules for applications like 5G will be described.

It can be used for far-field and radiating near field OTA Testing in an embodiment according to the invention.

The antenna layout (or design) in accordance with the embodiment of the invention was optimized to be used in a socket for OTA testing using automated test equipment. In an OTA test and measurement application the requirements are different from a known antenna layout (or design) for a AiP antenna array, so it was found that it is advantageous to use an antenna technology which is different from the antenna topology used on an AiP antenna array like a 5G module:

- because in OTA application the measuring antenna is a single antenna element (not an antenna array), size of the antenna is not critical;

- antenna gain is not critical because it is used on the radiating near-field (close to the DUT unlike a base station in a real OTA scenario), important is to have a large bandwidth to cover all the frequencies to be tested.

In the following, an idea underlying embodiments of the invention will be described.

Antenna design (or antenna layout)

Antenna design (or antenna layout) shown in Figs. 2A to 2C comprises a dual-polarized waveguide (230), a waveguide backshort (220) and PCB (210). Two orthogonal pairs of differentially fed microstrip probes (212) are disposed inside an aperture cutout area (211 ) so as they excite the main orthogonal modes of the waveguide (TEw & TE01).

Differential feeding helps to provide symmetry to antenna circuit, increases decoupling between orthogonal arms and widens operational bandwidth. Probe’s feeding networks are disposed on the opposite layers of the PCB for ease of routing and high isolation. This enables PCB process simplicity because no blind/buried via is required. The feeding networks are connected to differential lines or differential line transitions (216) with 100 Ohm differential interfaces. This provides versatility of antenna circuit integration to transceiver chain components on the same board.

Finally, the probes utilize several PCB layers connected through probe via (218) (“thick probes”) and there is a through hole (211 ) inside the aperture cutout for increasing antenna bandwidth. According to an aspect of the invention, another possibility of usage of magnetic interaction for testing is to include additional new circuits in DFT parts for structural tests so that additional possibilities with dynamic magnetic fields are created by induction e.g. intervene in SCAN test. Complex logic has the disadvantage that the scan chains must be loaded often to reach sufficiently high test coverage (it should be> 99% for high quality products). However, most of the circuit area is easy to reach but the chains must be always fully loaded, therefore, additional test options in complex areas have significant impact on test time and test costs.

Antenna simulation results are shown in Figs. 6A and 6B.

Electrical performance

Operational frequency band: 22-43 GHz (65%) considering 10 dB RL

Insertion loss in antenna circuit: 0.75... 1.35 dB over the frequency band (Megtron6-based board)

Antenna gain: 6-9.5 dBi over the band

Port-to-port leakage: < -80 dB over the band

Cross-polarized component discrimination in far-field: >55 dB over the band

Mechanical performance

Antenna circuit occupies only 2><2A0 area in PCB (A0 calculated at the center frequency 32.5 GHz):

Antenna PCB utilizes at least 3 layers, and its process does not require blind or buried via

OTA Antenna Prototype is shown in Figs. 5A to 5D.

Antenna Integration in the ATE Socket is shown in Figs. 7A to 7B. Moreover, it should be noted that the embodiments and procedures may be used as described in this section, and may optionally be supplemented by any of the features, functionalities and details disclosed herein (in this entire document), both individually and taken in combination.

However, the features, functionalities and details described in any other chapters can also, optionally, be introduced into the embodiments according to the present invention.

Also, the embodiments described in the above mentioned chapters can be used individually, and can also be supplemented by any of the features, functionalities and details in another chapter.

Also, it should be noted that individual aspects described herein can be used individually or in combination. Thus, details can be added to each of said individual aspects without adding details to another one of said aspects.

In particular, embodiments are also described in the claims. The embodiments described in the claims can optionally be supplemented by any of the features, functionalities and details as described herein, both individually and in combination.

Also, any of the features and functionalities described herein can be implemented in hardware or in software, or using a combination of hardware and software, as will be described in the section “implementation alternatives”.

Implementation Alternatives

Although some aspects are described in the context of an apparatus, it is clear that these aspects also represent a description of the corresponding method, where a block or device corresponds to a method step or a feature of a method step. Analogously, aspects described in the context of a method step also represent a description of a corresponding block or item or feature of a corresponding apparatus. Some or all of the method steps may be executed by (or using) a hardware apparatus, like for example, a microprocessor, a programmable computer or an electronic circuit. In some embodiments, one or more of the most important method steps may be executed by such an apparatus.

Depending on certain implementation requirements, embodiments of the invention can be implemented in hardware or in software. The implementation can be performed using a digital storage medium, for example a floppy disk, a DVD, a Blu-Ray, a CD, a ROM, a PROM, an EPROM, an EEPROM or a FLASH memory, having electronically readable control signals stored thereon, which cooperate (or are capable of cooperating) with a programmable computer system such that the respective method is performed. Therefore, the digital storage medium may be computer readable.

Some embodiments according to the invention comprise a data carrier having electronically readable control signals, which are capable of cooperating with a programmable computer system, such that one of the methods described herein is performed.

Generally, embodiments of the present invention can be implemented as a computer program product with a program code, the program code being operative for performing one of the methods when the computer program product runs on a computer. The program code may for example be stored on a machine readable carrier.

Other embodiments comprise the computer program for performing one of the methods described herein, stored on a machine readable carrier.

In other words, an embodiment of the inventive method is, therefore, a computer program having a program code for performing one of the methods described herein, when the computer program runs on a computer.

A further embodiment of the inventive methods is, therefore, a data carrier (or a digital storage medium, or a computer-readable medium) comprising, recorded thereon, the computer program for performing one of the methods described herein. The data carrier, the digital storage medium or the recorded medium are typically tangible and/or non-transitionary.

A further embodiment of the inventive method is, therefore, a data stream or a sequence of signals representing the computer program for performing one of the methods described herein. The data stream or the sequence of signals may for example be configured to be transferred via a data communication connection, for example via the Internet.

A further embodiment comprises a processing means, for example a computer, or a programmable logic device, configured to or adapted to perform one of the methods described herein.

A further embodiment comprises a computer having installed thereon the computer program for performing one of the methods described herein.

A further embodiment according to the invention comprises an apparatus or a system configured to transfer (for example, electronically or optically) a computer program for performing one of the methods described herein to a receiver. The receiver may, for example, be a computer, a mobile device, a memory device or the like. The apparatus or system may, for example, comprise a file server for transferring the computer program to the receiver.

In some embodiments, a programmable logic device (for example a field programmable gate array) may be used to perform some or all of the functionalities of the methods described herein. In some embodiments, a field programmable gate array may cooperate with a microprocessor in order to perform one of the methods described herein. Generally, the methods are preferably performed by any hardware apparatus.

The apparatus described herein may be implemented using a hardware apparatus, or using a computer, or using a combination of a hardware apparatus and a computer.

The apparatus described herein, or any components of the apparatus described herein, may be implemented at least partially in hardware and/or in software.

The methods described herein may be performed using a hardware apparatus, or using a computer, or using a combination of a hardware apparatus and a computer.

The methods described herein, or any components of the apparatus described herein, may be performed at least partially by hardware and/or by software.

The herein described embodiments are merely illustrative for the principles of the present invention. It is understood that modifications and variations of the arrangements and the details described herein will be apparent to others skilled in the art. It is the intent, therefore, to be limited only by the scope of the impending patent claims and not by the specific details presented by way of description and explanation of the embodiments herein