Title:
ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2023/145567
Kind Code:
A1
Abstract:
The objective of the present invention is to provide an adhesive tape having excellent adhesiveness and exhibiting excellent holding power even when subjected to long-term shear stress at high temperatures. The present invention is an adhesive tape comprising an adhesive layer, wherein: the adhesive layer contains an acrylic copolymer having a structural unit derived from a (meth)acrylic acid alkyl ester and a structural unit derived from an olefin polymer having a polymerizable unsaturated double bond at a terminal end; and the adhesive layer has a swelling ratio of 40 to 500 when immersed in tetrahydrofuran at a temperature of 25 °C for 24 hours.
Inventors:
TSUJI NAGISA (JP)
OGATA YUDAI (JP)
OGATA YUDAI (JP)
Application Number:
PCT/JP2023/001309
Publication Date:
August 03, 2023
Filing Date:
January 18, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J133/06; C09J7/38; C09J151/06; C09J175/04
Domestic Patent References:
| WO2022230935A1 | 2022-11-03 | |||
| WO2022230936A1 | 2022-11-03 |
Foreign References:
| JP2003253225A | 2003-09-10 | |||
| JP2003013027A | 2003-01-15 | |||
| JP2003013028A | 2003-01-15 | |||
| JP2001131250A | 2001-05-15 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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