Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2020/049986
Kind Code:
A1
Abstract:
Provided is an adhesive sheet that can be used to grind a hard and brittle substrate during backgrinding of the hard and brittle substrate and that makes it possible to reduce pollution and achieve excellent productivity, grinding precision, and release. This adhesive sheet comprises an adhesive layer. The thickness of the adhesive layer is 1–300 μm. The indentation hardness H (Pa) of the adhesive layer at 25°C and the thickness hA (μm) of the adhesive layer satisfy the relationship in expression (1). (1) logH≥1.9385×loghA+4.2611.
Inventors:
UENO SHUSAKU (JP)
YUTOU TAKUMI (JP)
HIRAYAMA TAKAMASA (JP)
YUTOU TAKUMI (JP)
HIRAYAMA TAKAMASA (JP)
Application Number:
PCT/JP2019/032258
Publication Date:
March 12, 2020
Filing Date:
August 19, 2019
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; C09J11/08; C09J123/08; C09J125/08; C09J131/04; C09J201/00; H01L21/304
Domestic Patent References:
| WO2016135997A1 | 2016-09-01 |
Foreign References:
| JP2014201672A | 2014-10-27 | |||
| JP2016117839A | 2016-06-30 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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