Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE RESIN COMPOSITION, ADHESIVE RESIN MOLDED ARTICLE, ADHESIVE RESIN LAMINATE, AND HOUSING SEALING MEMBER
Document Type and Number:
WIPO Patent Application WO/2021/181314
Kind Code:
A1
Abstract:
The present invention provides an adhesive resin composition that exhibits both adhesive properties and gas barrier properties, an adhesive resin molded article, an adhesive resin laminate, and a housing sealing member. More specifically, the present invention provides an adhesive resin composition that contains, as essential components, an acid-modified polyolefin resin (A) and a gas barrier resin (B) that serves as a gas barrier component, wherein the density of the acid-modified polyolefin resin (A) is in the range of 0.8-1.0 g/cm3, the density of the gas barrier resin (B) is in the range of 1.1-1.5 g/cm3, and the adhesive resin composition contains 10-40 parts by weight of the gas barrier resin (B) per 100 parts by weight of all of the solid components.

Inventors:
TAKEI KUNIHIRO (JP)
MARUYAMA YUIKO (JP)
TAKEYAMA SHUNSUKE (JP)
Application Number:
PCT/IB2021/052011
Publication Date:
September 16, 2021
Filing Date:
March 11, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
C09J123/26; C09J7/35; C09J167/00; C09J177/00
Domestic Patent References:
WO2013015259A12013-01-31
Foreign References:
JP2016124876A2016-07-11
JP2016124877A2016-07-11
JP2015071746A2015-04-16
JP2014024876A2014-02-06
JP2014004778A2014-01-16
Download PDF: