Title:
ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2022/210058
Kind Code:
A1
Abstract:
The present invention relates to an adhesive film which sequentially comprises an adhesive layer, a base material layer and a slipping layer in this order, wherein: the adhesive layer contains an adhesive resin that has an elastic modulus of 100 MPa or less; the base material layer is formed of a thermoplastic resin film; and the slipping layer contains a polyethylene resin, while having a thickness of 8 μm or less. With respect to this adhesive film, the absolute value |∆E| of the difference between the elastic modulus EMD in the machine direction and the elastic modulus ETD in the vertical direction is 500 MPa or more.
Inventors:
TOYAMA RYOTA (JP)
Application Number:
PCT/JP2022/012886
Publication Date:
October 06, 2022
Filing Date:
March 18, 2022
Export Citation:
Assignee:
YUPO CORP (JP)
International Classes:
A47L25/00; B32B27/00; C09J7/24; C09J7/29; C09J7/38; C09J201/00
Foreign References:
| JP2002113817A | 2002-04-16 | |||
| JP2002307554A | 2002-10-23 | |||
| JP2003210382A | 2003-07-29 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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