ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHODS FOR PRODUCING SAME

Title:

ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHODS FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2024/042720

Kind Code:

A1

Abstract:

An adhesive film for circuit connection comprising a first adhesive layer having thermosettability, conductive particles partially embedded in one side of the first adhesive layer, and a second adhesive layer that has thermosettability and contacts one side of the first adhesive layer, the embedding rate of conductive particles in the first adhesive layer being 30-90% and the ratio of the flow rate of the second adhesive layer to the flow rate of the first adhesive layer being 1.20-4.00.

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Inventors:

MIYAJI MASAYUKI (JP)
MORIYA TOSHIMITSU (JP)
YAMAZAKI YUTA (JP)

Application Number:

PCT/JP2022/032258

Publication Date:

February 29, 2024

Filing Date:

August 26, 2022

Export Citation:

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Assignee:

RESONAC CORP (JP)

International Classes:

C09J7/30; C09J9/02; C09J11/04; C09J201/00; H01B1/00; H01L21/60; H01R11/01; H05K3/32

Domestic Patent References:

WO2022102672A1	2022-05-19
WO2018051799A1	2018-03-22
WO2022102573A1	2022-05-19

Foreign References:

JP2017147224A

2017-08-24

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

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