ADHESIVE COMPOSITION, ADHESIVE SHEET, LAYERED BODY AND PRINTED WIRING BOARD

WIPO Patent Application WO/2023/008333

A1

Provided is an adhesive composition which exhibits excellent adhesive properties and soldering heat resistance, exhibits excellent adhesive properties even after being exposed to a high temperature environment for a long time, and exhibits satisfactory flexibility and tackiness when in the form of a semi-cured coating film. The adhesive composition contains a polyester resin (A1), a polyester resin (A2) and an epoxy resin (B) and is used for obtaining an adhesive sheet, a layered product and a printed wiring board that contain the adhesive composition. Polyester resin (A1) is a polyester resin which has a number average molecular weight of less than 10,000 and a glass transition temperature of lower than 15ºC and which contains a component (a) having a total of 3 hydroxyl groups and carboxyl groups as functional groups per molecule as a constituent component, with the content of component (a) being 3 mol% or more if the content of all polycarboxylic acid components that constitute the polyester resin (A1) is taken to be 100 mol%. Polyester resin (A2) is a polyester resin having a number average molecular weight of 10,000 or more and a glass transition temperature of 15ºC or higher.

SAKAMOTO KOICHI (JP)
KAWAKUSU TETSUO (JP)

PCT/JP2022/028490

February 02, 2023

July 22, 2022

Click for automatic bibliography generation  

TOYO BOSEKI (JP)

C09J167/00; B32B15/08; C08G63/16; C09J7/35; C09J163/00; H05K1/03

WO2011129323A1

2011-10-20

JPH08295792A	1996-11-12
JP2000178416A	2000-06-27
JP2010116514A	2010-05-27
JP2008019375A	2008-01-31
CN110527470A	2019-12-03

View/Download PDF      PDF Help

Previous Patent: TOOTHED BELT AND MANUFACTURING METHOD THEREFOR

Next Patent: BIOLOGICAL INFORMATION DISPLAY SYSTEM