Title:
ADHESIVE COMPOSITION AND PRODUCTION METHOD FOR ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/069992
Kind Code:
A1
Abstract:
Provided are: an adhesive composition that is highly bio-based and has suitable adhesion and high thermal resistance; and a production method for the same. This adhesive composition comprises: a block copolymer (X) that includes a polymer block (A) containing a structural unit derived from an aromatic vinyl compound and a polymer block (B) containing a structural unit derived from a conjugated diene compound; and a tackifier (Y). The block copolymer (X) includes, as the polymer block (B), at least one polymer block (B-1) containing a structural unit derived from β-farnesene, and the block copolymer (X) includes at least one block copolymer selected from the group consisting of a non-hydrogenated block copolymer (X0), which is a block copolymer that has not been hydrogenated, and a hydrogenated block copolymer (X1), which is a block copolymer that has been hydrogenated and which has a degree of hydrogenation of less than 50 mol%.
Inventors:
KANEKO SHUHEI (JP)
KONISHI DAISUKE (JP)
SASAKI HIROMITSU (JP)
KONISHI DAISUKE (JP)
SASAKI HIROMITSU (JP)
Application Number:
PCT/JP2022/041794
Publication Date:
April 04, 2024
Filing Date:
November 09, 2022
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C09J11/06; C09J121/00; C09J153/02
Domestic Patent References:
| WO2022045344A1 | 2022-03-03 |
Foreign References:
| JP2012502135A | 2012-01-26 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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