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Title:
ADHESIVE COMPOSITION, ADHESIVE LAYER, AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/145600
Kind Code:
A1
Abstract:
Provided is an adhesive composition from which an adhesive layer having a low dielectric constant can be formed.　Provided is an adhesive composition which contains a polyester-based resin containing a constituent unit derived from a compound having at least 20 carbon atoms and at least two functional groups capable of forming an ester bond, and which has a dielectric constant at a frequency of 100 kHz of 4.0 or less when the adhesive layer is formed. The adhesive composition preferably has a dielectric loss of 0.0001 to 0.15 at a frequency of 100 kHz when the adhesive layer is formed.

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Inventors:
SHIBANO MASAYA (JP)
HORIUCHI YOSHIYUKI (JP)
KATAMI HIROFUMI (JP)
Application Number:
PCT/JP2023/001524
Publication Date:
August 03, 2023
Filing Date:
January 19, 2023
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J167/00; C09J7/38
Domestic Patent References:
WO2021200716A12021-10-07
WO2022019260A12022-01-27
Foreign References:
JP2020175560A2020-10-29
JP2013039784A2013-02-28
JP2017171819A2017-09-28
JP2015105286A2015-06-08
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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