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Title:
ADHESIVE COMPOSITION, CIRCUIT CONNECTION MATERIAL, AND CONNECTION BODY
Document Type and Number:
WIPO Patent Application WO/2023/228729
Kind Code:
A1
Abstract:
This adhesive composition contains a thermoplastic resin (a), a radical-polymerizable compound (b), and a radical polymerization initiator (c). A polyurethane resin (a-1) and a phenoxy resin (a-2) are contained as the thermoplastic resin (a). A radical-polymerizable compound (b-1) having a structure in which an isocyanate group is protected by a blocking agent and a radical-polymerizable compound (b-2) having a phosphoric acid group are contained as the radical-polymerizable compound (b). The content of the radical-polymerizable compound (b-2) having a phosphoric acid group is 1.6 mass% or less relative to the total amount of the adhesive composition.

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Inventors:
AKIYAMA YUYA (JP)
KUDO SUNAO (JP)
Application Number:
PCT/JP2023/017470
Publication Date:
November 30, 2023
Filing Date:
May 09, 2023
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C09J9/02; C09J7/38; C09J11/06; C09J161/04; C09J175/06; H01B1/22
Foreign References:
JP2018184607A2018-11-22
JP2013231097A2013-11-14
JP2015183118A2015-10-22
JP2015151536A2015-08-24
JP2011142103A2011-07-21
JP2005290241A2005-10-20
JP2016135850A2016-07-28
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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