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Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/080200
Kind Code:
A1
Abstract:
Provided are: an active-ray-sensitive or radiation-sensitive resin composition comprising a resin (A) that includes an acid-decomposable group and a phenolic hydroxyl group, a resin (B) that does not contain an acid-decomposable group, an acid generator (C), and an acid diffusion control agent (D), wherein the resin (B) includes a repeating unit (b1) having a hydrophilic group and a fluorine atom, the hydrophilic group and the fluorine atom in the repeating unit (b1) are covalently bonded to a main chain of the resin (B) or are covalently bonded to a side chain that is covalently bonded to the main chain of the resin (B), and the resin (B) does not contain an ammonium salt structure; and an active-ray-sensitive or radiation-sensitive film, a pattern formation method, and an electronic device manufacturing method which use said active-ray-sensitive or radiation-sensitive resin composition.

Inventors:
TAKAHASHI KOTARO (JP)
KAMINO YUKA (JP)
Application Number:
PCT/JP2023/036196
Publication Date:
April 18, 2024
Filing Date:
October 04, 2023
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F212/14; C08F220/24; G03F7/20
Foreign References:
JP2008122932A2008-05-29
JP2010176036A2010-08-12
JP2007297500A2007-11-15
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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