ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD

Title:

ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2024/070964

Kind Code:

A1

Abstract:

The present invention provides: an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) and a non-ionic compound (C), wherein the resin (A) has a repeating unit represented by general formula (A1) described in the specification, and -NO2 bonds to an aromatic ring in the non-ionic compound (C); an actinic ray-sensitive or radiation-sensitive film formed using the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method; and an electronic device manufacturing method.

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Inventors:

MIYOSHI TARO (JP)
YAMAGUCHI SHUHEI (JP)
MOTOYAMA HIROKI (JP)

Application Number:

PCT/JP2023/034554

Publication Date:

April 04, 2024

Filing Date:

September 22, 2023

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

G03F7/039; C08F12/22; G03F7/038; G03F7/20

Domestic Patent References:

WO2016148042A1

2016-09-22

Foreign References:

JP2019168475A

2019-10-03

Attorney, Agent or Firm:

KOH-EI, P.C. (JP)

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