ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD

Title:

ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2024/024669

Kind Code:

A1

Abstract:

The present invention provides: an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) the polarity of which is increased by action of acid and a specific compound (B) represented by a general formula (B-1) described in the specification; an actinic ray-sensitive or radiation-sensitive film formed from the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method; and an electronic device manufacturing method.

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Inventors:

YAMAGUCHI SHUHEI (JP)
MIYOSHI TARO (JP)
TAKAHASHI KOTARO (JP)

Application Number:

PCT/JP2023/026778

Publication Date:

February 01, 2024

Filing Date:

July 21, 2023

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

G03F7/004; C08F12/02; C08F20/12; G03F7/039; G03F7/20

Domestic Patent References:

WO2021246448A1

2021-12-09

Foreign References:

JP2021107850A	2021-07-29
JP2021076784A	2021-05-20
JP2020148901A	2020-09-17

Attorney, Agent or Firm:

KOH-EI, P.C. (JP)

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