Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND POLYMER
Document Type and Number:
WIPO Patent Application WO/2023/157712
Kind Code:
A1
Abstract:
The present invention addresses a first problem of providing an actinic ray-sensitive or radiation-sensitive resin composition from which a pattern having an excellent resolution is formed. The present invention also addresses a second problem of providing a resist film, a pattern formation method, and an electronic device manufacturing method, all of which involve the actinic ray-sensitive or radiation-sensitive resin composition. The present invention further addresses a third problem of providing a polymer that can be provided to the actinic ray-sensitive or radiation-sensitive resin composition. An actinic ray-sensitive or radiation-sensitive resin composition according to the present invention contains a solvent and a polymer including a repeating unit represented by formula (1) or formula (2). In formula (1), X represents a halogen atom. R1-R3 each independently represent a hydrogen atom or a substituent group. However, at least one of the R1 and the R2 represents an electron-withdrawing group. In formula (2), X represents a halogen atom. R4 represents a hydrogen atom or a substituent group. L1 and L2 each independently represent -CO-, -SO-, or -SO2-. L3 represents a single bond or a divalent linkage group.
Inventors:
ISHIJI YOHEI (JP)
TAKAHASHI SATOMI (JP)
HATAKEYAMA NAOYA (JP)
TAKAHASHI SATOMI (JP)
HATAKEYAMA NAOYA (JP)
Application Number:
PCT/JP2023/003929
Publication Date:
August 24, 2023
Filing Date:
February 07, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/038; C08F20/54; C08F22/40; G03F7/039; G03F7/20
Domestic Patent References:
| WO2019187803A1 | 2019-10-03 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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