Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN-FORMING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/054126
Kind Code:
A1
Abstract:
Provided are: an actinic ray-sensitive or radiation-sensitive resin composition containing an acid decomposable resin (A) and a photoacid generator (B), the (A) having a repeating unit having a specific structure, the solubility parameter of which is greater than 20.31 MPa1/2, the content of the (B) being 15.0 mass% or greater with respect to the total solid content of the composition; an actinic ray-sensitive or radiation-sensitive film formed from said composition; a pattern-forming method using said composition, and an electronic device manufacturing method. The actinic ray-sensitive or radiation-sensitive resin composition, the actinic ray-sensitive or radiation-sensitive film, the pattern-forming method, and the electronic device manufacturing method thereby excel in resolution in the formation of an extremely fine pattern, even with the lapse of time after preparation.
Inventors:
FUKAMI YUTARO (JP)
HATAKEYAMA NAOYA (JP)
GOTO AKIYOSHI (JP)
HATAKEYAMA NAOYA (JP)
GOTO AKIYOSHI (JP)
Application Number:
PCT/JP2022/035213
Publication Date:
April 06, 2023
Filing Date:
September 21, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F232/08; G03F7/004; G03F7/038; G03F7/20
Domestic Patent References:
| WO2018043255A1 | 2018-03-08 |
Foreign References:
| JP2015025880A | 2015-02-05 | |||
| JP2011022564A | 2011-02-03 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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