Title:
ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/186059
Kind Code:
A1
Abstract:
Provided is an actinic-ray-sensitive or radiation-sensitive resin composition that, when forming an ultra-fine pattern (such as a line and space pattern with a line or space width of 20 nm or less, a hole pattern with a hole diameter of 20 nm or less), has extremely excellent resolution capacity. The actinic-ray-sensitive or radiation-sensitive resin composition comprises (A) a resin that decomposes by the action of an acid to have increased polarity and an ionic compound, wherein the ionic compound contains (B) an ionic compound that generates an acid by exposure to actinic rays or radiation and (C) an ionic compound that decomposes by exposure to actinic rays or radiation to have decreased acid capturing capacity, or contains (D) an ionic compound that generates an acid by exposure to actinic rays or radiation and decomposes by exposure to actinic rays or radiation to have decreased acid capturing capacity, and the resin (A) has repeating units represented by specific formula.
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Inventors:
HATAKEYAMA NAOYA (JP)
ISHIHARA HIDEYUKI (JP)
GOTO AKIYOSHI (JP)
SHIRAKAWA MICHIHIRO (JP)
ISHIHARA HIDEYUKI (JP)
GOTO AKIYOSHI (JP)
SHIRAKAWA MICHIHIRO (JP)
Application Number:
PCT/JP2022/007734
Publication Date:
September 09, 2022
Filing Date:
February 24, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F212/14; C08F220/26; C08F232/00; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2018043255A1 | 2018-03-08 |
Foreign References:
JP2015025880A | 2015-02-05 | |||
JP2011022564A | 2011-02-03 | |||
JP2014041326A | 2014-03-06 | |||
JP2011170316A | 2011-09-01 |
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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