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Patent Searching and Data


Title:
ACOUSTIC WAVE FILTER PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/246601
Kind Code:
A1
Abstract:
The present application relates to an acoustic wave filter packaging structure and a manufacturing method therefor, and an electronic device. The packaging structure comprises an acoustic wave filter packaging module, which comprises a first plastic package layer, a plurality of acoustic wave filters, a first protective layer, and a redistribution layer, wherein the first plastic package layer at least partially wraps each acoustic wave filter, and a plurality of first protruding blocks on a first surface of each acoustic wave filter is exposed out of the first plastic package layer; the first protective layer covers a first face of the first plastic package layer, and is respectively provided with a first via hole at a position corresponding to each first protruding block; the redistribution layer is arranged on the face of the first protective layer that is away from the first plastic package layer, and is respectively electrically connected to the first protruding blocks by means of the plurality of first via holes. The acoustic wave filters in the packaging structure have high film pressure resistance and good structural stability, and the packaging structure has an improved yield and improved efficiency controllability and reduced thickness and size, which can satisfy the integration requirements of smaller-sized electronic devices.

Inventors:
CHEN CHIENHUA (CN)
LIN LAICUN (CN)
ZHANG SHAN (CN)
LIU GUOWEN (CN)
Application Number:
PCT/CN2021/095514
Publication Date:
December 01, 2022
Filing Date:
May 24, 2021
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L41/053; H03H9/64
Foreign References:
US20120223789A12012-09-06
CN110120373A2019-08-13
US20140197915A12014-07-17
US20130321102A12013-12-05
CN112687629A2021-04-20
US20140097913A12014-04-10
Attorney, Agent or Firm:
BEIJING GLOBAL INTELLECTUAL PROPERTY LAW FIRM (CN)
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