Title:
ACOUSTIC WAVE DEVICE, METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/248751
Kind Code:
A1
Abstract:
The present invention can ensure bonding strength between an electrode layer and an under bump metal. The present invention has a piezoelectric layer, an electrode layer positioned on an upper surface of the piezoelectric layer, an under bump metal, and a bump. The under bump metal has a first region that bonds directly to the piezoelectric layer, and a second region that bonds to the electrode layer, and in a plan view of the piezoelectric layer, at least a portion of the first region overlaps at least a portion of the bump.
Inventors:
IKEGAMI YOSHIHIDE (JP)
Application Number:
PCT/JP2023/020401
Publication Date:
December 28, 2023
Filing Date:
June 01, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H03H3/08; H03H9/145
Domestic Patent References:
| WO2016088830A1 | 2016-06-09 |
Foreign References:
| JP2014099781A | 2014-05-29 | |||
| JP2010098098A | 2010-04-30 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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