To apply a semiconductor device and the manufacture method to the TCP(tape carrier package) semiconductor device of high quality, which realizes a considerably narrow frame in a liquid crystal module.

A device hole 2a is pierced in a base material 2 and a metal wiring pattern 3 is formed on the base material 2. An insulating film 4 is formed to cover the device hole 2a from a metal pattern wiring 3-side. At that time, the insulating film 4 fixes inner leads 3a... protruded onto the device hole 2a in the metal wiring pattern 3. A semiconductor chip 5 is arranged to face the device hole 2a from a base material 2-side and electrodes 5a... are thermo- compression-bonded to the inner leads 3a... through an anisotropic conductive film 6 so as to connect them. Thus, the considerably narrow frame is realized in the liquid crystal module with such a structure. Then, the TCP semiconductor device 1 of high quality can be manufactured by the simple manufacture method of high yield.