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Patent Searching and Data


Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2000109623
Kind Code:
A
Abstract:

To obtain a resin composition which can give a lightweight film having excellent heat insulation properties and good transparency, tensile break resistance, and impact break resistance and being useful as an agricultural film by mixing an ethylene/α-olefin copolymer with an inorganic compound containing Si, Al, Mg, Ca, or the like.

This composition comprises 85-99 wt.% (A) ethylene/6C or higher α-olefin copolymer having the following properties: the melt flow rate is 0.01-10 g/10 min; when tested by temperature rising elution fractionation(TREF), it gives an elution curve in which at least one peak appears, the main peak stands at a temperature of 100°C or below, the eluate amount (Y: wt.% based on the entire copolymer) at 50°C in TREF satisfies the relationship: Y ≤-4,500 D+4,105 ≤100 (wherein D is the density of component A and is below 0.91 g/cm3) and the relationship: Y ≤10 (wherein D is 0.91 g/cm3 or above); and the content of the 6C or higher α-olefin is 2-60 wt.% and 15-1 wt.% (B) inorganic compound containing an atom selected among Si, Al, Mg, and Ca.


Inventors:
YAMAMOTO KOJI
SHICHIJO YOSHIKO
Application Number:
JP28572699A
Publication Date:
April 18, 2000
Filing Date:
May 27, 1993
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
A01G13/02; A01G9/14; C08K3/10; C08K3/22; C08K3/26; C08K3/36; C08L23/08; (IPC1-7): C08L23/08; C08K3/10; C08K3/22; C08K3/26; C08K3/36
Attorney, Agent or Firm:
Kazuo Sato (2 outside)