Title:
【発明の名称】超音波探触子の製造方法
Document Type and Number:
Japanese Patent JP2545861
Kind Code:
B2
Abstract:
In an ultrasonic transducer having a matrix of piezoelectric elements an L-shaped printed wiring board (6 min , 3 min ) is bonded to an array (1b) of piezoelectric elements (1). The bonding points of the L-shaped printed wiring board to respective piezoelectric elements (1) are located at edge portions of respective back electrodes (2A) of the elements. The other branch of the L-shaped printed wiring board (6 min , 3 min ) is extended vertically to the surface of the piezoelectric element matrix. A backing plate (15) is formed by molding on the back side of the piezoelectric element matrix leaving the top of the L-shaped printed wiring board protruding from the molded surface of the molded backing plate (15). To produce this structure a flexible printed wiring board (6, 3) is provided with a wiring pattern having bonding areas (34) positioned corresponding to a matrix of piezoelectric elements (1). After bonding, the printed wiring board (6, 3) is cut and bent vertically to the matrix surface to form the L-shape. The matrix of piezoelectric elements (1) may be cut out from a large-size piezoelectric element (1 min ) before the molding of the backing plate (15) or after its molding.
Inventors:
KAWABE KENJI
WATANABE KAZUHIRO
NAMIKI FUMIHIRO
IIDA ATSUO
SHIMURA NOBUSHIRO
WATANABE KAZUHIRO
NAMIKI FUMIHIRO
IIDA ATSUO
SHIMURA NOBUSHIRO
Application Number:
JP14729287A
Publication Date:
October 23, 1996
Filing Date:
June 12, 1987
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
A61B8/00; B06B1/06; G01N29/04; G01N29/24; H04R17/00; (IPC1-7): H04R17/00
Domestic Patent References:
| JP58118739A |
Attorney, Agent or Firm:
Teiichi