Title:
METHOD FOR MANUFACTURING ELECTRONIC MATERIAL
Document Type and Number:
Japanese Patent JP2017001012
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent particles such as an abrasive grain or polishing debris and a foreign material generated from a packing container from firmly fixed on an electronic material substrate to provide an electronic material with high-cleanliness that is required for high recording density.SOLUTION: A method for manufacturing an electronic material includes a cleaning process of using a cleaning agent (C) to control a water contact angle with respect to an electronic material intermediate body surface to 30° or less at 25°C using an electronic material intermediate body that has a water contact angle of 35° or more at 25°C with respect to an electronic material intermediate body surface.SELECTED DRAWING: None
Inventors:
TAKEDA TAKUMA
YAMAGUCHI SHUNICHIRO
YAMAGUCHI SHUNICHIRO
Application Number:
JP2016001706A
Publication Date:
January 05, 2017
Filing Date:
January 07, 2016
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
B08B1/00; B08B3/12; C11D1/06; C11D1/34; C11D1/72; C11D1/722; C11D1/90; G11B5/84